Invention Application
- Patent Title: FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE MECHANICAL STABILITY AND HEAT DISSIPATION
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Application No.: US17680308Application Date: 2022-02-25
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Publication No.: US20220270942A1Publication Date: 2022-08-25
- Inventor: Nataporn Charusabha , Kunakorn Kaoson , Saravuth Sirinorakul , Sukhontip Jaikongkaew , Il Kwon Shim
- Applicant: UTAC Headquarters Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: UTAC Headquarters Pte. Ltd.
- Current Assignee: UTAC Headquarters Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L23/24
- IPC: H01L23/24 ; H01L23/00 ; H01L23/367 ; H01L21/56
Abstract:
A flip chip package is disclosed. The package includes a leadframe surrounding a flip chip. The leadframe and flip chip are encapsulated by a mold compound. The leadframe provides package support to enhance the mechanical stability of the package. In some cases, a heat dissipating structure is disposed on top of the package, connecting the flip chip to enhance heat dissipation.
Information query
IPC分类:
