公开(公告)号：US12166050B2

公开(公告)日：2024-12-10

申请号：US17478978

申请日：2021-09-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Il Kwon Shim

IPC: H01L27/146 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover with a cover adhesive is disposed over a sensor region of the die and attached to the die by the cover adhesive. The cover adhesive is disposed in a cap bonding region of the protective cover.

公开(公告)号：US12100719B2

公开(公告)日：2024-09-24

申请号：US17352348

申请日：2021-06-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Il Kwon Shim

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14683

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die region with a die attached thereto. An encapsulant is disposed to cover encapsulation region of the package substrate. A protective cover is disposed over the die and attached to the encapsulant by a cover adhesive. The protective cover is supported by a lower portion of step shaped inner encapsulant sidewalls.

公开(公告)号：US11901308B2

公开(公告)日：2024-02-13

申请号：US17382283

申请日：2021-07-21

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Saravuth Sirinorakul ,  Il Kwon Shim ,  Kok Chuen Lock ,  Roel Adeva Robles ,  Eakkasit Dumsong

IPC: H01L23/552 ,  H01L23/36 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/495

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/49503 ,  H01L24/32 ,  H01L2224/32245

Abstract: The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.

公开(公告)号：US20230274979A1

公开(公告)日：2023-08-31

申请号：US18175124

申请日：2023-02-27

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Dzafir Bin Mohd Shariff ,  Enrique E. Sarile, JR. ,  Jackson Fernandez Rosario ,  Ronnie M. De Villa ,  Chan Loong Neo ,  Il Kwon Shim

IPC: H01L21/78 ,  H01L29/06 ,  H01L21/683

CPC classification number: H01L21/78 ,  H01L29/0657 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L21/3065

Abstract: Reliable plasma dicing of a processed wafer with a die attach film (DAF) attached to the bottom wafer surface to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer to serve as a dicing mask. Laser processing is employed to form a modified layer with cracks on a bottom portion of the wafer. Plasma dicing partially dices the processed wafer to about the modified layer. The dicing tape is expanded laterally away from the center of the partially diced processed wafer, singulating it into individual dies. Singulation of the partially plasma diced processed wafer is facilitated by the modified layer.

公开(公告)号：US20250151447A1

公开(公告)日：2025-05-08

申请号：US18927456

申请日：2024-10-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Catherine Chang ,  Il Kwon Shim

IPC: H01L27/146

Abstract: A semiconductor device has a semiconductor die including a photonic circuit. A first adhesive bead is deposited over the semiconductor die around the photonic circuit. A second adhesive bead is deposited over the first adhesive bead. An inner edge of the second adhesive bead is offset toward the photonic circuit relative to an inner edge of the first adhesive bead. A lens is disposed over the second adhesive bead. An encapsulant is deposited over the semiconductor die and lens.

公开(公告)号：US11881494B2

公开(公告)日：2024-01-23

申请号：US17480090

申请日：2021-09-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Il Kwon Shim

IPC: H01L23/12 ,  H01L27/146 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L27/14618 ,  H01L21/56 ,  H01L23/3185 ,  H01L24/32 ,  H01L24/83 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14687 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/73265

Abstract: A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The package includes a dam structure configured to protect components of the semiconductor package from contamination.

公开(公告)号：US20230036239A1

公开(公告)日：2023-02-02

申请号：US17814593

申请日：2022-07-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Emmanuel Espiritu ,  Il Kwon Shim ,  Jeffrey Punzalan ,  Jose Mari Casticimo

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/18

Abstract: A semiconductor device has a substrate. A semiconductor die with a photosensitive circuit is disposed over the substrate. A lens comprising a protective layer is disposed over the photosensitive circuit. An encapsulant is deposited over the substrate, semiconductor die, and lens. The protective layer is removed after depositing the encapsulant.

公开(公告)号：US20250151421A1

公开(公告)日：2025-05-08

申请号：US18926920

申请日：2024-10-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Catherine Chang ,  Il Kwon Shim

IPC: H01L27/146 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00

Abstract: A semiconductor device has a photonic semiconductor die and a lens mounted onto the photonic semiconductor die. The photonic semiconductor die and lens are singulated prior to mounting the lens onto the photonic semiconductor die. An adhesive bead is formed on the photonic semiconductor die to seal a cavity between the lens and photonic semiconductor die. The photonic semiconductor die and lens are disposed into a storage media for transporting the photonic semiconductor die to a semiconductor packaging facility. The photonic semiconductor and lens are disposed on a substrate after mounting the lens onto the photonic semiconductor die. An encapsulant is deposited over the substrate, lens, and photonic semiconductor die.

公开(公告)号：US11670521B2

公开(公告)日：2023-06-06

申请号：US17125995

申请日：2020-12-17

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Il Kwon Shim ,  Jeffrey Punzalan

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/60

CPC classification number: H01L21/561 ,  H01L23/31 ,  H01L24/14 ,  H01L24/94 ,  H01L2021/60097

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The protective cover is supported by a standoff structure disposed on the die and below the protective cover. An encapsulant is disposed to cover the package substrate while leaving the top package surface exposed.

公开(公告)号：US20220384505A1

公开(公告)日：2022-12-01

申请号：US17664510

申请日：2022-05-23

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Emmanuel Espiritu ,  Il Kwon Shim ,  Jeffrey Punzalan ,  Teddy Joaquin Carreon

IPC: H01L27/146 ,  H01L23/31

Abstract: A semiconductor device has a substrate. A semiconductor die including a photosensitive circuit is disposed over the substrate. A shield is disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit. An outer section of the shield is attached to the substrate and includes a second opening. An encapsulant is deposited over the substrate and semiconductor die. The encapsulant extends into the first opening and a first area between the shield and substrate while a second area over the photosensitive circuit remains devoid of the encapsulant.