公开(公告)号：US20220270942A1

公开(公告)日：2022-08-25

申请号：US17680308

申请日：2022-02-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Nataporn Charusabha ,  Kunakorn Kaoson ,  Saravuth Sirinorakul ,  Sukhontip Jaikongkaew ,  Il Kwon Shim

IPC: H01L23/24 ,  H01L23/00 ,  H01L23/367 ,  H01L21/56

Abstract: A flip chip package is disclosed. The package includes a leadframe surrounding a flip chip. The leadframe and flip chip are encapsulated by a mold compound. The leadframe provides package support to enhance the mechanical stability of the package. In some cases, a heat dissipating structure is disposed on top of the package, connecting the flip chip to enhance heat dissipation.