Electronic equipment includes a cover including a first hole, a printed circuit having at least one microphone mounted thereon and including a second hole, a heatsink including a third hole, a thermal pad including a fourth hole, and a compression element, the electronic equipment being arranged in such a manner that the first hole, the second hole, the third hole, and the fourth hole together define an acoustic duct that is arranged to enable the microphone to pick up sound signals coming from outside the electronic equipment, and in such a manner that the compression element compresses the thermal pad around the acoustic duct in order to ensure sound-proofing of the acoustic duct.