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公开(公告)号:US20240098421A1
公开(公告)日:2024-03-21
申请号:US18463945
申请日:2023-09-08
Applicant: SAGEMCOM BROADBAND SAS
IPC: H04R9/02 , H04N21/426 , H04R1/02 , H04R1/28 , H05K7/20
CPC classification number: H04R9/022 , H04N21/426 , H04R1/025 , H04R1/028 , H04R1/2826 , H05K7/2039
Abstract: Equipment includes a speaker enclosure comprising a chamber, a loudspeaker, and a vent; an electronic component; a heat sink device arranged to dissipate the heat generated by the electronic component and comprising both the vent and also a thermally conductive element that extends from an end of the vent and that is thermally coupled with the electronic component.
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公开(公告)号:US20220272441A1
公开(公告)日:2022-08-25
申请号:US17673065
申请日:2022-02-16
Applicant: SAGEMCOM BROADBAND SAS
Inventor: Arnaud FERREIRA , Charles-Efflam MARTIN DE MONTAUDRY
Abstract: Electronic equipment includes a cover including a first hole, a printed circuit having at least one microphone mounted thereon and including a second hole, a heatsink including a third hole, a thermal pad including a fourth hole, and a compression element, the electronic equipment being arranged in such a manner that the first hole, the second hole, the third hole, and the fourth hole together define an acoustic duct that is arranged to enable the microphone to pick up sound signals coming from outside the electronic equipment, and in such a manner that the compression element compresses the thermal pad around the acoustic duct in order to ensure sound-proofing of the acoustic duct.
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