Invention Application
- Patent Title: PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL
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Application No.: US17637622Application Date: 2020-06-09
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Publication No.: US20220275241A1Publication Date: 2022-09-01
- Inventor: Kentaro FURUE , Yoshikazu ARAI
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Priority: JP2019-155417 20190828
- International Application: PCT/JP2020/022733 WO 20200609
- Main IPC: C09D163/04
- IPC: C09D163/04 ; C09D133/14 ; C09D7/41 ; C09D7/63 ; H01L51/52

Abstract:
The present invention reduces inhibition of light sensitization of a photosensitive resin composition containing a black dye and increases sensitivity by improving pattern forming ability. The photosensitive resin composition according to one embodiment of the present invention contains a binder resin (A), a radiation-sensitive compound (B), and a dye (C), wherein the dye (C) contains a black dye (C1) and a dye (C2) other than (C1), the dye (C2) has an absorption maximum at a wavelength of 480-550 nm in an wavelength range of 300-800 nm, and, when the absorbance of the dye (C2) at the absorption maximum wavelength is defined as Abs1 and the average absorbance of the dye (C2) at wavelengths 560-600 nm is defined as Abs2, Abs2/Abs1 equals 0.1-1.0.
Information query
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