Invention Application
- Patent Title: Precision Structured Glass Articles, integrated circuit packages, optical devices, microfluidic devices, and Methods for Making the Same
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Application No.: US17743643Application Date: 2022-05-13
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Publication No.: US20220278005A1Publication Date: 2022-09-01
- Inventor: Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun-Ro Yoon
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Main IPC: H01L23/13
- IPC: H01L23/13 ; B32B17/06 ; B81B1/00 ; C03C3/087 ; C03C3/091 ; C03C3/093 ; C03C3/097 ; C03C15/00 ; H01L21/48 ; H01L23/15 ; H01L23/498
Abstract:
The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
Public/Granted literature
Information query
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