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公开(公告)号：US20200235020A1
公开(公告)日：2020-07-23
申请号：US16633368
申请日：2018-07-24
申请人： CORNING INCORPORATED
发明人： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun Ro Yoon
IPC分类号： H01L23/13 , C03C15/00 , B32B17/06 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , H01L23/15 , H01L23/498 , B81B1/00 , H01L21/48
摘要： The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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公开(公告)号：US20240140854A1
公开(公告)日：2024-05-02
申请号：US18279254
申请日：2022-03-01
申请人： CORNING INCORPORATED
发明人： Qiang Fu , Aize Li , Hugh Michael McMahon
摘要： A silicate-based glass composition includes 15-65 wt. % SiO2, 2.5-25 wt. % MgO, 1-30 wt. % P2O5, and 15-50 wt. % CaO, such that the composition has a hydrolytic resistance of glass grains (HGB) of at most 3, when measured by International Organization for Standardization section 719 (ISO 719) and forms a bioactive crystalline phase in a simulated body fluid.
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公开(公告)号：US11527452B2
公开(公告)日：2022-12-13
申请号：US17743643
申请日：2022-05-13
申请人： CORNING INCORPORATED
发明人： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun-Ro Yoon
IPC分类号： H01L23/495 , H01L23/13 , B81B1/00 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , C03C15/00 , H01L21/48 , H01L23/15 , H01L23/498 , B32B17/06 , C03C23/00
摘要： The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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公开(公告)号：US20220278005A1
公开(公告)日：2022-09-01
申请号：US17743643
申请日：2022-05-13
申请人： CORNING INCORPORATED
发明人： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun-Ro Yoon
IPC分类号： H01L23/13 , B32B17/06 , B81B1/00 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , C03C15/00 , H01L21/48 , H01L23/15 , H01L23/498
摘要： The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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公开(公告)号：US11367665B2
公开(公告)日：2022-06-21
申请号：US16633368
申请日：2018-07-24
申请人： CORNING INCORPORATED
发明人： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun Ro Yoon
IPC分类号： H01L23/495 , H01L23/13 , B32B17/06 , B81B1/00 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , C03C15/00 , H01L21/48 , H01L23/15 , H01L23/498 , C03C23/00
摘要： The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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