Invention Application
- Patent Title: RESIN COMPOSITION AND FILM
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Application No.: US17751985Application Date: 2022-05-24
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Publication No.: US20220282089A1Publication Date: 2022-09-08
- Inventor: Takashi Ando , Kohei Ogawa , Masahiro Miyamoto
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2019-232976 20191224,JP2020-014037 20200130
- Main IPC: C08L79/08
- IPC: C08L79/08 ; C08L69/00 ; C08L67/03

Abstract:
A resin composition contains a polyimide resin and an ester-based resin. The ester-based resin is polycarbonate or polyarylate. The polyimide contains a structural unit represented by general formula (1). In general formula (1), X is a divalent organic group shown in group (I), and Y is a divalent group that contains one or more selected from the group consisting of a fluorine group, a trifluoromethyl group, a sulfonic group, a fluorene structure and an alicyclic structure. Each of R1 and R2 is a fluorine atom, an alkyl group having 1 to 20 carbon atoms, or a fluoroalkyl group having 1 to 20 carbon atoms, m is an integer of 1 to 4, and n is an integer of 0 to 4.
Information query