Invention Application
- Patent Title: Sensor Element and Method for Manufacturing a Sensor Element
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Application No.: US17637768Application Date: 2020-09-16
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Publication No.: US20220283040A1Publication Date: 2022-09-08
- Inventor: Anke Weidenfelder , Jan Ihle , Thomas Stendel , Lutz Heiner Kirsten
- Applicant: TDK Electronics AG
- Applicant Address: DE Munich
- Assignee: TDK Electronics AG
- Current Assignee: TDK Electronics AG
- Current Assignee Address: DE Munich
- Priority: DE102019131306.6 20191120
- International Application: PCT/EP2020/075850 WO 20200916
- Main IPC: G01K7/22
- IPC: G01K7/22 ; H01C7/04 ; H05K1/18

Abstract:
In an embodiment a sensor element includes a carrier having an electrically insulating material, a top side and a bottom side, an NTC thermistor arranged on the top side of the carrier and at least two first electrodes configured for electrically contacting the sensor element, wherein the first electrodes are arranged on the top side of the carrier, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration in an electrically insulating manner.
Information query