公开(公告)号：US20220283040A1

公开(公告)日：2022-09-08

申请号：US17637768

申请日：2020-09-16

Applicant: TDK Electronics AG

Inventor： Anke Weidenfelder ,  Jan Ihle ,  Thomas Stendel ,  Lutz Heiner Kirsten

IPC: G01K7/22 ,  H01C7/04 ,  H05K1/18

Abstract: In an embodiment a sensor element includes a carrier having an electrically insulating material, a top side and a bottom side, an NTC thermistor arranged on the top side of the carrier and at least two first electrodes configured for electrically contacting the sensor element, wherein the first electrodes are arranged on the top side of the carrier, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration in an electrically insulating manner.

公开(公告)号：US12287246B2

公开(公告)日：2025-04-29

申请号：US17639781

申请日：2021-08-31

Applicant: TDK Electronics AG

Inventor： Anke Weidenfelder ,  Jan Ihle ,  Bernhard Ostrick ,  Jeffrey Krotosky

IPC: G01K7/20 ,  B81C1/00 ,  G01K7/16

Abstract: In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.

公开(公告)号：US20220357214A1

公开(公告)日：2022-11-10

申请号：US17639781

申请日：2021-08-31

Applicant: TDK Electronics AG ,  Tronics MEMS, Inc.

Inventor： Anke Weidenfelder ,  Jan Ihle ,  Bernhard Ostrick ,  Jeffrey Krotosky

IPC: G01K7/20

Abstract: In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.