Invention Application
- Patent Title: SUBSTRATE TRANSFER DEVICE AND SUBSTRATE PROCESSING SYSTEM
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Application No.: US17652334Application Date: 2022-02-24
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Publication No.: US20220285191A1Publication Date: 2022-09-08
- Inventor: Dongwei LI , Takehiro SHINDO
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP2021-032793 20210302
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/687

Abstract:
A substrate transfer device includes: a planar motor provided in a transfer chamber and including an array of coils; a transfer unit configured to move above the planar motor; and a controller configured to control supply of a current to the array of the coils, wherein the transfer unit includes: a first base including an array of first magnets and configured to move above the planar motor; a second base including an array of second magnets and configured to move above the planar motor, the second base being arranged coaxially with the first base; and at least one arm configured to be extended/contracted by rotating the second base relative to the first base.
Public/Granted literature
- US11948822B2 Substrate transfer device and substrate processing system Public/Granted day:2024-04-02
Information query
IPC分类: