公开(公告)号：US20220301911A1

公开(公告)日：2022-09-22

申请号：US17692754

申请日：2022-03-11

Applicant: Tokyo Electron Limited

Inventor： Dongwei LI ,  Takehiro SHINDO

IPC: H01L21/677 ,  H01L21/67

Abstract: An opening/closing apparatus for opening/closing an opening which allows a first chamber and a second chamber adjacent to the first chamber to communicate with each other, includes a planar motor including coils arranged in the first chamber, a moving body including a valve body configured to move on the planar motor and close the opening, and a controller configured to control energization of the coils.

公开(公告)号：US20220285191A1

公开(公告)日：2022-09-08

申请号：US17652334

申请日：2022-02-24

Applicant: Tokyo Electron Limited

Inventor： Dongwei LI ,  Takehiro SHINDO

IPC: H01L21/677 ,  H01L21/687

Abstract: A substrate transfer device includes: a planar motor provided in a transfer chamber and including an array of coils; a transfer unit configured to move above the planar motor; and a controller configured to control supply of a current to the array of the coils, wherein the transfer unit includes: a first base including an array of first magnets and configured to move above the planar motor; a second base including an array of second magnets and configured to move above the planar motor, the second base being arranged coaxially with the first base; and at least one arm configured to be extended/contracted by rotating the second base relative to the first base.

公开(公告)号：US20240120225A1

公开(公告)日：2024-04-11

申请号：US18273446

申请日：2022-01-12

Applicant: Tokyo Electron Limited

Inventor： Takehiro SHINDO ,  Akinori SHIMAMURA ,  Hiromitsu SAKAUE ,  Dongwei LI

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67709 ,  H01L21/67017

Abstract: Provided is an apparatus that transfers a substrate inside a substrate transfer chamber by a substrate transfer module using magnetic levitation. The apparatus includes: a substrate transfer chamber having a floor portion provided with a first magnet and connected, through an opening portion, to a substrate processing chamber in which the substrate is processed; and a substrate transfer module including a substrate holder configured to hold the substrate, and a second magnet configured such that a repulsive force acts between the first magnet and the second magnet. The substrate transfer module is movable inside the substrate transfer chamber by the magnetic levitation based on the repulsive force. The substrate transfer module performs loading/unloading of the substrate by directly entering into the substrate transfer chamber via the opening portion, or delivers the substrate to and from a substrate transfer mechanism fixedly provided inside the substrate transfer chamber.

公开(公告)号：US20230307278A1

公开(公告)日：2023-09-28

申请号：US18120195

申请日：2023-03-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Dongwei LI

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67709 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748

Abstract: A substrate processing system comprises a module having a mounting unit on which a substrate is mounted, a transfer chamber connected to the module, and a substrate transfer device disposed in the transfer chamber and configured to transfer the substrate to the module. The substrate transfer device includes a transfer unit having a substrate holder and a base that has therein a magnet and moves the substrate holder along a bottom portion of the transfer chamber, and a planar motor having a plurality of tiles arranged along the bottom portion of the transfer chamber, a plurality of electromagnetic coils disposed in the plurality of tiles, and a linear driving device configured to supply power to the electromagnetic coils and magnetically levitate and linearly drive the base. A tile corresponding to the module among the plurality of tiles is connected to the module without being connected to the transfer chamber.

公开(公告)号：US20230170239A1

公开(公告)日：2023-06-01

申请号：US17991345

申请日：2022-11-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro SHINDO ,  Dongwei LI ,  Lingxin JIANG ,  Shinya OKANO ,  Toshiaki KODAMA ,  Wataru MATSUMOTO

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67748 ,  H01L21/67265 ,  H01L21/67333

Abstract: An apparatus for transferring a substrate to a substrate processing chamber. The apparatus comprises: a substrate transfer chamber having a floor and a side wall; a substrate transfer module comprising a holder and second magnets, and configured to be movable in the substrate transfer chamber by magnetic levitation; and a controller configured to control an operating force for moving the substrate transfer module. The controller comprises: a parameter storage configured to store at least one model parameter; a control schedule creating section configured to acquire identification information and a movement schedule, to obtain the operating force, and to output a control schedule; and a magnetic force adjusting section configured to perform feedforward control.

公开(公告)号：US20220076977A1

公开(公告)日：2022-03-10

申请号：US17446739

申请日：2021-09-02

Applicant: Tokyo Electron Limited

Inventor： Tomonori HORIUCHI ,  Dongwei LI

IPC: H01L21/677 ,  B65G49/06 ,  H01L21/67

Abstract: A transfer apparatus transfers a first substrate and a second substrate while holding the first substrate and the second substrate to overlap each other in a plan view. The transfer apparatus includes: a first holding arm configured to hold the first substrate in a horizontal direction; a second holding arm configured to hold the second substrate in the horizontal direction; a first detection sensor configured to detect presence/absence of the first substrate held by the first holding arm; and a second detection sensor configured to detect presence/absence of the second substrate held by the second holding arm, wherein the first detection sensor includes a sensor configured to detect the presence/absence of the first substrate, and wherein the first holding arm includes a notch formed at least at an inner end portion of a tip of the first holding arm and configured to allow the optical axis to pass therethrough.