- 专利标题: SUBSTRATE PROCESSING APPARATUS AND METHOD OF CONTROLLING THE SAME
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申请号: US17689659申请日: 2022-03-08
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公开(公告)号: US20220293399A1公开(公告)日: 2022-09-15
- 发明人: Kiyoshi MORI
- 申请人: TOKYO ELECTRON LIMITED
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2021-040513 20210312
- 主分类号: H01J37/32
- IPC分类号: H01J37/32
摘要:
A substrate processing apparatus includes: a processing container having a plurality of processing spaces formed therein; a substrate stage arranged in each of the plurality of processing spaces; a rotary arm including at least one end effector capable of holding a substrate and having a rotation axis located at a position equidistant from the plurality of processing spaces; a sensor provided on a back surface of the at least one end effector of the rotary arm, which is opposite to a substrate holding surface of the at least one end effector; and a rotation mechanism configured to rotate the rotary arm so that the sensor is moved to a position facing the substrate stage or the substrate placed on the substrate stage inside the processing container.
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