Invention Application
- Patent Title: SEGMENTATION OF DESIGN CARE AREAS WITH A RENDERED DESIGN IMAGE
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Application No.: US17203719Application Date: 2021-03-16
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Publication No.: US20220301133A1Publication Date: 2022-09-22
- Inventor: Manikandan Mariyappan , Jin Qian , Zhuang Liu , Xiaochun Li , Siqing Nie
- Applicant: KLA Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA Corporation
- Current Assignee: KLA Corporation
- Current Assignee Address: US CA Milpitas
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/11
Abstract:
A rendered image is generated from a semiconductor device design file. The rendered image is segmented based on a grey level of the rendered image. Care areas are determined based on the segmenting. Defect inspection is performed in the care areas. This process can be performed on a wafer inspection tool that uses photon optics or electron beam optics.
Public/Granted literature
- US12165306B2 Segmentation of design care areas with a rendered design image Public/Granted day:2024-12-10
Information query
