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公开(公告)号：US12165306B2
公开(公告)日：2024-12-10
申请号：US17203719
申请日：2021-03-16
Applicant: KLA Corporation
Inventor： Manikandan Mariyappan , Jin Qian , Zhuang Liu , Xiaochun Li , Siqing Nie
Abstract: A rendered image is generated from a semiconductor device design file. The rendered image is segmented based on a grey level of the rendered image. Care areas are determined based on the segmenting. Defect inspection is performed in the care areas. This process can be performed on a wafer inspection tool that uses photon optics or electron beam optics.
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公开(公告)号：US20220301133A1
公开(公告)日：2022-09-22
申请号：US17203719
申请日：2021-03-16
Applicant: KLA Corporation
Inventor： Manikandan Mariyappan , Jin Qian , Zhuang Liu , Xiaochun Li , Siqing Nie
Abstract: A rendered image is generated from a semiconductor device design file. The rendered image is segmented based on a grey level of the rendered image. Care areas are determined based on the segmenting. Defect inspection is performed in the care areas. This process can be performed on a wafer inspection tool that uses photon optics or electron beam optics.
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