公开(公告)号：US20210158223A1

公开(公告)日：2021-05-27

申请号：US17098256

申请日：2020-11-13

Applicant: KLA Corporation

Inventor： Abdurrahman Sezginer ,  Gordon Rouse ,  Manikandan Mariyappan

IPC: G06N20/10 ,  G01N21/956 ,  G01N21/95

Abstract: Context attributes for optical imaging of a patterned layer of a semiconductor die are calculated. Calculating the context attributes includes calculating convolutions of a pattern of the patterned layer with respective kernels of a plurality of kernels, wherein the plurality of kernels is orthogonal. Defects on the semiconductor die are found in accordance with the context attributes.

公开(公告)号：US12165306B2

公开(公告)日：2024-12-10

申请号：US17203719

申请日：2021-03-16

Applicant: KLA Corporation

Inventor： Manikandan Mariyappan ,  Jin Qian ,  Zhuang Liu ,  Xiaochun Li ,  Siqing Nie

IPC: G06T7/00 ,  G06T7/11

Abstract: A rendered image is generated from a semiconductor device design file. The rendered image is segmented based on a grey level of the rendered image. Care areas are determined based on the segmenting. Defect inspection is performed in the care areas. This process can be performed on a wafer inspection tool that uses photon optics or electron beam optics.

公开(公告)号：US20220301133A1

公开(公告)日：2022-09-22

申请号：US17203719

申请日：2021-03-16

Applicant: KLA Corporation

Inventor： Manikandan Mariyappan ,  Jin Qian ,  Zhuang Liu ,  Xiaochun Li ,  Siqing Nie

IPC: G06T7/00 ,  G06T7/11

Abstract: A rendered image is generated from a semiconductor device design file. The rendered image is segmented based on a grey level of the rendered image. Care areas are determined based on the segmenting. Defect inspection is performed in the care areas. This process can be performed on a wafer inspection tool that uses photon optics or electron beam optics.