Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US17834020Application Date: 2022-06-07
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Publication No.: US20220302052A1Publication Date: 2022-09-22
- Inventor: SE-HO YOU , SEONGHO SHIN , BANGWEON LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0049074 20200423
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/00

Abstract:
A semiconductor device may include a substrate, a first semiconductor chip buried in the substrate, a first antenna pattern, a second antenna pattern, and outer terminals. A bottom surface of the substrate may include first and second regions spaced apart from each other. The first semiconductor chip may have a first active surface that is directed to the top surface of a core portion of the substrate. The first antenna pattern may be provided on the top surface of the substrate and electrically connected to the first semiconductor chip. The outer terminals may be provided on the first region of the bottom surface of the substrate, and the second antenna pattern may be provided on the second region of the bottom surface of the substrate.
Public/Granted literature
- US11855013B2 Semiconductor device Public/Granted day:2023-12-26
Information query
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