公开(公告)号：US20230387026A1

公开(公告)日：2023-11-30

申请号：US18098972

申请日：2023-01-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： SEONGHO SHIN ,  Jonghyeon KIM

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48 ,  H01L25/18 ,  H05K1/11

CPC classification number: H01L23/5383 ,  H01L23/49816 ,  H01L23/5384 ,  H01L24/16 ,  H01L25/0657 ,  H01L24/32 ,  H01L24/73 ,  H01L23/481 ,  H01L25/18 ,  H05K1/116 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K2201/10234 ,  H05K2201/2081

Abstract: Disclosed is a semiconductor package comprising a solder ball, a printed circuit board on the solder ball, a bump on the printed circuit board, and a semiconductor chip on the bump. The printed circuit board includes a base substrate, a low-k dielectric layer that penetrates the base substrate, a connection conductive structure electrically connected to the bump and surrounded by the low-k dielectric layer, and a lower conductive structure electrically connected to the solder ball and the connection conductive structure. A top surface of the lower conductive structure is in contact with a first bottom surface of the low-k dielectric layer.

公开(公告)号：US20250089371A1

公开(公告)日：2025-03-13

申请号：US18626413

申请日：2024-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： KYOUNGSUK YANG ,  SEONGHO SHIN ,  MI-NA CHOI ,  JU-YOUN CHOI

IPC: H01L27/12 ,  G09G3/00

Abstract: A driving circuit mounting film according to an embodiment includes a base film having a first surface and a second surface facing each other, a driving circuit part positioned on the first surface of the base film, a plurality of signal lines positioned on the first surface of the base film, and a test signal pad part positioned on the second surface of the base film, wherein the test signal pad part includes a plurality of openings, and at least part of the plurality of openings overlaps with at least part of the plurality of first signal lines.

公开(公告)号：US20220302052A1

公开(公告)日：2022-09-22

申请号：US17834020

申请日：2022-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： SE-HO YOU ,  SEONGHO SHIN ,  BANGWEON LEE

IPC: H01L23/66 ,  H01L23/00

Abstract: A semiconductor device may include a substrate, a first semiconductor chip buried in the substrate, a first antenna pattern, a second antenna pattern, and outer terminals. A bottom surface of the substrate may include first and second regions spaced apart from each other. The first semiconductor chip may have a first active surface that is directed to the top surface of a core portion of the substrate. The first antenna pattern may be provided on the top surface of the substrate and electrically connected to the first semiconductor chip. The outer terminals may be provided on the first region of the bottom surface of the substrate, and the second antenna pattern may be provided on the second region of the bottom surface of the substrate.

公开(公告)号：US20210335734A1

公开(公告)日：2021-10-28

申请号：US17121898

申请日：2020-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： SE-HO YOU ,  SEONGHO SHIN ,  BANGWEON LEE

IPC: H01L23/66 ,  H01L23/00

Abstract: A semiconductor device may include a substrate, a first semiconductor chip buried in the substrate, a first antenna pattern, a second antenna pattern, and outer terminals. A bottom surface of the substrate may include first and second regions spaced apart from each other. The first semiconductor chip may have a first active surface that is directed to the top surface of a core portion of the substrate. The first antenna pattern may be provided on the top surface of the substrate and electrically connected to the first semiconductor chip. The outer terminals may be provided on the first region of the bottom surface of the substrate, and the second antenna pattern may be provided on the second region of the bottom surface of the substrate.