- 专利标题: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
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申请号: US17398668申请日: 2021-08-10
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公开(公告)号: US20220320319A1公开(公告)日: 2022-10-06
- 发明人: MING-TE CHEN , HUI-TING TSAI , JUN HE , KUO-FENG YU , CHUN HSIUNG TSAI
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/78 ; H01L27/088 ; H01L21/8234 ; H01L21/02
摘要:
A semiconductor structure, a method for manufacturing a FinFET structure and a method for manufacturing a semiconductor structure are provided. The method for forming a FinFET structure includes: providing a FinFET precursor including a plurality of fins and a plurality of gate trenches between the fins; forming a first portion of the trench dummy of a dummy gate within the plurality of gate trenches; removing at least a part of the first portion of the trench dummy; forming a second portion of the trench dummy over the first portion of the trench dummy; performing a first thermal treatment to the first and second portions of the trench dummy; and forming a blanket dummy of the dummy gate over the second portion of the trench dummy. The present disclosure further provides a FinFET structure with an improved metal gate.
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