Invention Application
- Patent Title: METHOD FOR MANUFACTURING MICRONEEDLE ARRAY
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Application No.: US17849097Application Date: 2022-06-24
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Publication No.: US20220324141A1Publication Date: 2022-10-13
- Inventor: Toshihiro Usa , Yasuhiro Sekizawa , Kenichiro Tamaki , Satoshi Chai , Kozue Ikeda
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2019-236672 20191226
- Main IPC: B29C33/38
- IPC: B29C33/38 ; B29C33/40

Abstract:
Provided is a method for manufacturing a microneedle array, which enables efficient and stable manufacturing of a microneedle array including a needle-shaped protrusion having a constricted shape. The method for manufacturing a microneedle array includes: a first cutting step of forming a needle-shaped protrusion by cutting a base material by a first cutting tool; a second cutting step of forming a constricted shape in the needle-shaped protrusion by cutting a part of the needle-shaped protrusion by a second cutting tool different from the first cutting tool; a mold forming step of molding, from a plate precursor manufactured through the first cutting step and the second cutting step, a resin mold having a needle-shaped hole which has an inverted shape of the plate precursor; a first array manufacturing step of filling the needle-shaped hole of the resin mold with a drug solution and then drying the drug solution; a second array manufacturing step of filling the needle-shaped hole with a base material solution and drying the base material solution, after the first array manufacturing step; and a peeling step of peeling, from the resin mold, a microneedle array manufactured by the resin mold.
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