公开(公告)号：US11007678B2

公开(公告)日：2021-05-18

申请号：US15933573

申请日：2018-03-23

Applicant: FUJIFILM Corporation

Inventor： Shotaro Ogawa ,  Satoshi Chai ,  Kenji Ichikawa ,  Kazunori Komatsu ,  Kozue Ikeda ,  Ryo Hibino

IPC: B29C33/38 ,  B29C33/42 ,  B81C99/00 ,  A61M37/00 ,  B29C43/52 ,  B29C33/40 ,  B29C41/20 ,  B29C41/38 ,  B29C41/42 ,  C25D1/10 ,  B29K101/12 ,  B29L7/00 ,  B29L31/00

Abstract: A production method of a mold includes: preparing a plate precursor having a protruding pattern formed of protrusions in a pattern presence region on a base, and a thermoplastic resin sheet; determining a position at which the plate precursor is to be pressed against the thermoplastic resin sheet by moving the plate precursor and the thermoplastic resin sheet relative to each other; and forming a recessed pattern on the thermoplastic resin sheet by pressing the protrusions of the plate precursor which is heated against the thermoplastic resin sheet at a position where a part of the pattern presence region of the plate precursor excluding the protrusions is separated from a surface of the thermoplastic resin sheet, cooling the plate precursor in a state in where the pressed protrusions and the thermoplastic resin sheet are in contact with each other, and separating the plate precursor from the thermoplastic resin sheet.

公开(公告)号：US10926438B2

公开(公告)日：2021-02-23

申请号：US17026286

申请日：2020-09-20

Applicant: FUJIFILM Corporation

Inventor： Satoshi Chai ,  Toshihiro Usa

IPC: B29C45/14 ,  A61M37/00 ,  B29C33/38 ,  B29C39/02 ,  C25D1/10 ,  B29C59/02 ,  B29C45/26 ,  B29K101/10 ,  B29K83/00 ,  B29L31/00 ,  B29C45/00

Abstract: Provided are a production method of a mold having a recessed pedestal pattern for preventing a liquid flow and a manufacturing method of a pattern sheet. A production method of a mold having a recessed pedestal pattern, has: a step of preparing an insert mold having a protruding needle pattern group; a step of preparing a mold having a first mold provided with a protruding pedestal shape and a second mold; a holding step of holding the protruding pedestal shape of the first mold and the protruding needle pattern group of the insert mold in an overlapping manner; a clamping step of performing clamping with the first mold and the second mold to form a cavity; and an injection step of filling the cavity with a resin.

公开(公告)号：US10648095B2

公开(公告)日：2020-05-12

申请号：US15592199

申请日：2017-05-11

Applicant: FUJIFILM Corporation

Inventor： Satoshi Chai ,  Kenji Ichikawa ,  Ryo Hibino

IPC: B29C33/42 ,  C25D1/10 ,  B29C33/38 ,  B29C33/40 ,  B29C39/02 ,  B29C39/26 ,  B29C39/36 ,  C25D1/20 ,  B29L31/00 ,  A61M37/00 ,  B29K105/00 ,  B29L7/00

Abstract: Provided are a production method of a mold, a manufacturing method of a pattern sheet, a production method of an electroform, a production method of a mold using an electroform, and an original. The production method includes: preparing an original having an inclined portion which is formed in an enclosed shape on an outer peripheral portion of a protruding pattern formed at a center portion on a base and gradually increases in thickness from inside toward outside, and a thermoplastic resin sheet; and forming a recessed pattern on the thermoplastic resin sheet by pressing the original which is heated against the thermoplastic resin sheet at a position where a flat surface of the original and a surface of the thermoplastic resin sheet are separated from each other, cooling the original in the state where the original is pressed, and separating the original from the thermoplastic resin sheet.

公开(公告)号：US11772305B2

公开(公告)日：2023-10-03

申请号：US18049643

申请日：2022-10-26

Applicant: FUJIFILM Corporation

Inventor： Aya Mochizuki ,  Satoshi Chai ,  Toshihiro Usa ,  Kozue Ikeda

IPC: B29C33/38 ,  A61M37/00 ,  B29C33/40 ,  B29C33/42

CPC classification number: B29C33/3857 ,  A61M37/0015 ,  B29C33/3842 ,  B29C33/40 ,  A61M2037/0053 ,  B29C33/424 ,  B29C2033/426

Abstract: A production method of a mold having a recessed pattern includes: a plate precursor preparation step of preparing a plate precursor having a pedestal on which a protruding pattern is disposed; a resin plate preparation step of preparing a thermoplastic resin plate having a recessed step portion; and a resin plate precursor production step of producing a thermoplastic resin plate precursor. The plate precursor comprises a substrate having a larger area than the pedestal in a plan view on a side opposite to a surface of the pedestal on which the protruding pattern is disposed. An edge portion where a side surface of the pedestal and the substrate are in contact with each other has a through-hole penetrating the substrate along the side surface of the pedestal.

公开(公告)号：US11534943B2

公开(公告)日：2022-12-27

申请号：US16807181

申请日：2020-03-03

Applicant: FUJIFILM Corporation

Inventor： Aya Mochizuki ,  Satoshi Chai ,  Toshihiro Usa ,  Kozue Ikeda

IPC: B29C33/38 ,  A61M37/00 ,  B29C33/40 ,  B29C33/42

Abstract: A production method of a mold having a recessed pattern includes: a plate precursor preparation step of preparing a plate precursor having a pedestal on which a protruding pattern is disposed; a resin plate preparation step of preparing a thermoplastic resin plate having a recessed step portion; and a resin plate precursor production step of producing a thermoplastic resin plate precursor, the resin plate precursor production step including a positioning step of positioning the protruding pattern of the plate precursor and a center position of the recessed step portion, and a recessed pattern forming step of forming a recessed pattern having an inverted shape of the protruding pattern on the thermoplastic resin plate by pressing the protruding pattern of the heated plate precursor and the pedestal against the recessed step portion, thereafter cooling the plate precursor, and separating the plate precursor from the thermoplastic resin plate.

公开(公告)号：US20220324141A1

公开(公告)日：2022-10-13

申请号：US17849097

申请日：2022-06-24

Applicant: FUJIFILM Corporation

Inventor： Toshihiro Usa ,  Yasuhiro Sekizawa ,  Kenichiro Tamaki ,  Satoshi Chai ,  Kozue Ikeda

IPC: B29C33/38 ,  B29C33/40

Abstract: Provided is a method for manufacturing a microneedle array, which enables efficient and stable manufacturing of a microneedle array including a needle-shaped protrusion having a constricted shape. The method for manufacturing a microneedle array includes: a first cutting step of forming a needle-shaped protrusion by cutting a base material by a first cutting tool; a second cutting step of forming a constricted shape in the needle-shaped protrusion by cutting a part of the needle-shaped protrusion by a second cutting tool different from the first cutting tool; a mold forming step of molding, from a plate precursor manufactured through the first cutting step and the second cutting step, a resin mold having a needle-shaped hole which has an inverted shape of the plate precursor; a first array manufacturing step of filling the needle-shaped hole of the resin mold with a drug solution and then drying the drug solution; a second array manufacturing step of filling the needle-shaped hole with a base material solution and drying the base material solution, after the first array manufacturing step; and a peeling step of peeling, from the resin mold, a microneedle array manufactured by the resin mold.