A thermal conductive silicone composition comprises: (A) a liquid organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 6 carbon atoms per molecule; (B) a thermal conductive filler with an average particle size of from 5 to 50 μm; (C) a thermal conductive filler with an average particle size of at least 0.1 μm and less than 5 μm; and (D) a carbasilatrane derivative. Optionally, the composition further comprises: (E) an organosiloxane having at least one silicon atom-bonded hydrogen atom per molecule; and/or (F) a hydrosilylation reaction catalyst. The composition exhibits excellent storage stability and handleability despite containing a large quantity of a thermal conductive filler to exhibit high thermal conductivity.