公开(公告)号：US20230193028A1

公开(公告)日：2023-06-22

申请号：US17911622

申请日：2020-03-16

Applicant: DOW SILICONES CORPORATION

Inventor： Chong XING ,  Dorab Edul BHAGWAGAR ,  Qiang HUANG ,  Lu ZOU ,  Rui YANG ,  Junmin ZHU

IPC: C08L83/04 ,  C08K3/22

CPC classification number: C08L83/04 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/005 ,  C08K2201/001

Abstract: A thermal conductive silicone composition is provided. The composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) an organopolysiloxane having at most two silicon atom-bonded hydrogen atoms per molecule; (D) an aluminum hydroxide powder, such as a mixture of an aluminum hydroxide powder having an average particle size of at least 0.1 μm and less than 5 μm and an aluminum hydroxide powder having an average particle size of 5 μm to 50 μm; and (E) a hydrosilylation reaction catalyst. The composition cures to form a thermal conductive soft material. The material generally has little to no change in hardness even if the composition is cured after long-term storage.

公开(公告)号：US20220325048A1

公开(公告)日：2022-10-13

申请号：US17620688

申请日：2019-06-21

Applicant: DOW SILICONES CORPORATION

Inventor： Debo HONG ,  Chong XING ,  Zhiting LIU

IPC: C08G77/44 ,  C08K5/549 ,  C08L83/10

Abstract: A thermal conductive silicone composition comprises: (A) a liquid organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 6 carbon atoms per molecule; (B) a thermal conductive filler with an average particle size of from 5 to 50 μm; (C) a thermal conductive filler with an average particle size of at least 0.1 μm and less than 5 μm; and (D) a carbasilatrane derivative. Optionally, the composition further comprises: (E) an organosiloxane having at least one silicon atom-bonded hydrogen atom per molecule; and/or (F) a hydrosilylation reaction catalyst. The composition exhibits excellent storage stability and handleability despite containing a large quantity of a thermal conductive filler to exhibit high thermal conductivity.