公开(公告)号：US20220325048A1

公开(公告)日：2022-10-13

申请号：US17620688

申请日：2019-06-21

Applicant: DOW SILICONES CORPORATION

Inventor： Debo HONG ,  Chong XING ,  Zhiting LIU

IPC: C08G77/44 ,  C08K5/549 ,  C08L83/10

Abstract: A thermal conductive silicone composition comprises: (A) a liquid organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 6 carbon atoms per molecule; (B) a thermal conductive filler with an average particle size of from 5 to 50 μm; (C) a thermal conductive filler with an average particle size of at least 0.1 μm and less than 5 μm; and (D) a carbasilatrane derivative. Optionally, the composition further comprises: (E) an organosiloxane having at least one silicon atom-bonded hydrogen atom per molecule; and/or (F) a hydrosilylation reaction catalyst. The composition exhibits excellent storage stability and handleability despite containing a large quantity of a thermal conductive filler to exhibit high thermal conductivity.

公开(公告)号：US20220267531A1

公开(公告)日：2022-08-25

申请号：US17620687

申请日：2019-06-21

Applicant: DOW SILICONES CORPORATION ,  DOW TORAY CO., LTD.

Inventor： Debo HONG ,  Xiucuo LI ,  Kazutoshi OKABE ,  Hiroshi ADACHI ,  Lei FANG ,  Qi CHEN

IPC: C08G77/18 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5415 ,  C08K5/544 ,  C08K5/549

Abstract: A method for producing a thixotropic curable silicone composition is provided. The curable silicone composition comprises: (A) a silicone base material comprising: an organopolysiloxane having at least two alkoxysilyl-containing groups per molecule and a filler other than fumed silica; (B) a hydrophobic fumed silica; (C) a carbasilatrane derivative; (D) an alkoxysilane or its partial hydrolysis and condensation product; and (E) a condensation reaction catalyst. The method comprises the following steps: (I) mixing components (A) and (B); (II) mixing component (C) with a mixture obtained by step (I); and (III) mixing components (D) and (E) with a mixture obtained by step (II) under free of moisture. The curable silicone composition obtained by the method has an excellent thixotropic property and can cure at room temperature by contact with moisture in air.