发明申请
- 专利标题: COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE SHEET
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申请号: US17849191申请日: 2022-06-24
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公开(公告)号: US20220325163A1公开(公告)日: 2022-10-13
- 发明人: Daisuke Hayashi , Seiichi Hitomi , Teruki Niori , Keita Takahashi
- 申请人: FUJIFILM Corporation
- 申请人地址: JP Tokyo
- 专利权人: FUJIFILM Corporation
- 当前专利权人: FUJIFILM Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2019-236138 20191226
- 主分类号: C09K5/14
- IPC分类号: C09K5/14 ; C08L63/00 ; C08L81/06 ; C08J5/18 ; C09J7/38 ; C09J7/25
摘要:
An object of the present invention is to provide a composition capable of forming a thermally conductive sheet having excellent peel strength. In addition, another object of the present invention is to provide a thermally conductive sheet formed of the composition and a device with a thermally conductive sheet.
The composition of the present invention contains a disk-like compound, a high-molecular-weight compound which is at least one selected from the group consisting of a thermoplastic resin and rubber, and inorganic particles.
The composition of the present invention contains a disk-like compound, a high-molecular-weight compound which is at least one selected from the group consisting of a thermoplastic resin and rubber, and inorganic particles.
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