• Patent Title: COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT
  • Application No.: US17754097
    Application Date: 2020-09-15
  • Publication No.: US20220333262A1
    Publication Date: 2022-10-20
  • Inventor: Nadine ENGELHARDTAlexander FLUEGELMarco ARNOLDCharlotte EMNET
  • Applicant: BASF SE
  • Applicant Address: DE Ludwigshafen am Rhein
  • Assignee: BASF SE
  • Current Assignee: BASF SE
  • Current Assignee Address: DE Ludwigshafen am Rhein
  • Priority: EP19200126.1 20190927
  • International Application: PCT/EP2020/075761 WO 20200915
  • Main IPC: C25D1/00
  • IPC: C25D1/00
COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT
Abstract:
Disclosed herein is a composition for copper bump electrodeposition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight Mw of from 900 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a C2 to C6 polyoxyalkylene group, and (c) the average number of oxyalkylene units in the polyoxyalkylene group is from more than 10 to less than 30 per N-hydrogen atoms in the polyalkyleneimine.
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