Invention Application
- Patent Title: COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT
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Application No.: US17754097Application Date: 2020-09-15
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Publication No.: US20220333262A1Publication Date: 2022-10-20
- Inventor: Nadine ENGELHARDT , Alexander FLUEGEL , Marco ARNOLD , Charlotte EMNET
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Priority: EP19200126.1 20190927
- International Application: PCT/EP2020/075761 WO 20200915
- Main IPC: C25D1/00
- IPC: C25D1/00

Abstract:
Disclosed herein is a composition for copper bump electrodeposition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight Mw of from 900 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a C2 to C6 polyoxyalkylene group, and (c) the average number of oxyalkylene units in the polyoxyalkylene group is from more than 10 to less than 30 per N-hydrogen atoms in the polyalkyleneimine.
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