公开(公告)号：US20220356592A1

公开(公告)日：2022-11-10

申请号：US17754110

申请日：2020-09-15

Applicant: BASF SE

Inventor： Marco ARNOLD ,  Alexander FLUEGEL ,  Charlotte EMNET ,  Nadine ENGELHARDT

IPC: C25D5/00 ,  C25D5/16 ,  C25D7/12

Abstract: Disclosed herein is a composition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight MW of from 600 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a polyoxyalkylene group including an oxyethylene and a C3 to C6 oxyalkylene unit, and (c) the average number of oxyalkylene units in the polyoxyalkylene groups is of from more than 10 to less than 30 per N-hydrogen atom in the polyalkyleneimine.

公开(公告)号：US20210180201A1

公开(公告)日：2021-06-17

申请号：US17048770

申请日：2019-04-11

Applicant: BASF SE

Inventor： Alexander FLUEGEL ,  Marco ARNOLD ,  Nadine ENGELHARDT ,  Marcel Patrik KIENLE

IPC: C25D3/32

Abstract: The present invention provides an aqueous composition comprising tin ions and at least one compound of formula I wherein X1 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O or S or a C5 to C12 aromatic moiety, R11 is a copolymer of ethylene oxide and a further C3 to C6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight, R12 is selected from H, R11, R40, R13, R14, are (a) independently selected from H, R11, R40, or (b) may together form a divalent group X13; X13 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O, S or NR43; R40 is H or a linear or branched C1-C20 alkyl, R43 is selected from H, R11 and a linear or branched C1-C20 alkyl.

公开(公告)号：US20240060201A1

公开(公告)日：2024-02-22

申请号：US17753653

申请日：2020-09-08

Applicant: BASF SE

Inventor： Marco ARNOLD ,  Alexander FLUEGEL ,  Elisabeth KUTTNER ,  Doris KREMZOW-GRAW ,  Nadine ENGELHARDT ,  Johannes KASCHEL

IPC: C25D3/32 ,  C25D3/64 ,  C07C321/20 ,  C07C335/18 ,  C07D213/32 ,  C07D277/26 ,  C07D233/60

CPC classification number: C25D3/32 ,  C25D3/64 ,  C07C321/20 ,  C07C335/18 ,  C07D213/32 ,  C07D277/26 ,  C07D233/60

Abstract: An aqueous composition including (a) metal ions including tin ions and silver ions and (b) at least one complexing agent of formula C11


RC12-XC11-RC11   (C11)

and their salts,



where
XC11 is selected from

(a) a divalent 5 or 6 membered aromatic N-heterocyclic group;
(b) a divalent 6 membered aromatic carbocyclic group; and
(c) a divalent 5 or 6 membered aliphatic N-heterocyclic group including one N atom and optionally a second heteroatom selected from N and O;


 all of which may be unsubstituted or substituted by one or more OH or one or more RC14;
RC11 is selected from










 ; and
RC12 is selected from RC11, XC11-RC11, H, OH, NRC142, C1 to C10 alkyl, and C1 to C10 alkoxy

公开(公告)号：US20230265576A1

公开(公告)日：2023-08-24

申请号：US18005171

申请日：2021-06-30

Applicant: BASF SE

Inventor： Charlotte EMNET ,  Verena STREMPEL ,  Lucas Benjamin HENDERSON ,  Alexander FLUEGEL ,  Robert BRAENDLE ,  Sathana KITAYAPORN ,  Nadine ENGELHARDT

IPC: C25D3/38

CPC classification number: C25D3/38

Abstract: Described herein is an acidic aqueous composition for copper electroplating including

(a) copper ions;
(b) bromide ions; and
(c) at least one additive of formula S1






where
XS1 is selected from the group consisting of a linear, branched or cyclic C1-C12 alkanediyl;
RS1 is a monovalent

(a) poly(oxy(C3 to C6)alkylene)-block-poly(oxyethylene) group, or
(b) a poly(oxyethylene)-block-poly(oxy(C3 to C6)alkylene)-block-poly(oxyethylene) group;


RS2, RS3, RS4

(a) are selected from the group consisting of H, RS1, RS40, or
(b) RS3 and an adjacent group RS4 or, if n>2, two adjacent groups RS4 may together form a divalent group XS3;


RS40 is selected from the group consisting of (a) linear or branched C1-C20 alkyl, and (b) linear or branched C1-C20 alkenyl;
XS3 is selected from the group consisting of a linear, branched or cyclic C1-C12 alkanediyl; and
n is an integer of from 1 to 6.

公开(公告)号：US20220298664A1

公开(公告)日：2022-09-22

申请号：US17805144

申请日：2022-06-02

Applicant: BASF SE

Inventor： Nadine ENGELHARDT ,  Dieter MAYER ,  Marco ARNOLD ,  Alexander FLUEGEL ,  Charlotte EMNET ,  Lucas Benjamin HENDERSON

IPC: C25D3/18 ,  C25D7/12 ,  C25D5/02

Abstract: Described herein is a cobalt electrodeposition composition including cobalt ions, and particular leveling agents including X1—CO—O—R11, X1—SO2—O—R11, X1—PO(OR11)2, X1—SO—O—R11 functional groups, where X1 is a divalent group selected from (i) a chemical bond (ii) aryl, (iii) C1 to C12 alkandiyl, which may be interrupted by O atoms, (iv) an arylalkyl group —X11—X12—, (v) an alkylaryl group —X12—X11— and (vi) —(O—C2H3R12)mO—, R11 is selected from H and C1 to C4 alkyl. R12 is selected from H and C1 to C4 alkyl, X12 is a divalent aryl group, and X11 is a divalent C1 to C15 alkandiyl group.

公开(公告)号：US20250129503A1

公开(公告)日：2025-04-24

申请号：US18691755

申请日：2022-09-23

Applicant: BASF SE

Inventor： Marco ARNOLD ,  Alexander FLUEGEL ,  Elisabeth KUTTNER ,  Nadine ENGELHARDT

IPC: C25D3/38 ,  C08G73/02 ,  C25D7/12 ,  H01L21/288

Abstract: Described herein is a copper electroplating composition including copper ions, an acid, and at least one polyaminoamide including a group of formula L1 [B-A-B′—Z]n[Y—Z]m  (L1) that is obtainable by reacting a diamine compound including two primary or secondary amino groups with an amino acid in a molar ratio of approx. 1:2 to form an aminoamide compound that is afterwards reacted with a coupling agent and optionally with a diamine co-monomer.

公开(公告)号：US20250051950A1

公开(公告)日：2025-02-13

申请号：US18721238

申请日：2022-12-20

Applicant: BASF SE

Inventor： Charlotte EMNET ,  Lucas Benjamin HENDERSON ,  Alexander FLUEGEL ,  Sathana KITAYAPORN ,  Nadine ENGELHARDT

IPC: C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  H01L21/768 ,  H01L23/532

Abstract: Disclosed herein is a composition for depositing copper on a semiconductor substrate, the composition including (a) copper ions; (b) an additive of formula S1 (c) a complexing agent; and (d) optionally a buffer or base to adjust the pH to a pH of from 7 to 13; where the pH of the composition is from 7 to 13 and where the composition is free of any cyanide.

公开(公告)号：US20230142238A1

公开(公告)日：2023-05-11

申请号：US17995186

申请日：2021-03-24

Applicant: BASF SE

Inventor： Marco ARNOLD ,  Alexander FLUEGEL ,  Charlotte EMNET ,  Nadine ENGELHARDT

IPC: C25D3/38

CPC classification number: C25D3/38

Abstract: Described herein is a composition including copper ions, an acid, and at least one polyaminoamide including, a group of formula L1


[A-B-A′-Z]n[Y—Z]m  (L1)

where
B is a diacid fragment of formula L2




A, A′ are amine fragments independently selected from the group consisting of formula L3a






and formula L3b








Y is a co-monomer fragment;

Z is a coupling fragment of formula L4





n is an integer of from 1 to 400; and

m is 0 or an integer of from 1 to 400.

公开(公告)号：US20210079548A1

公开(公告)日：2021-03-18

申请号：US16954333

申请日：2018-12-10

Applicant: BASF SE

Inventor： Alexander FLUEGEL ,  Marco ARNOLD ,  Marcel Patrik KIENLE ,  Nadine ENGELHARDT

IPC: C25D3/32 ,  C25D3/60 ,  C25D7/12

Abstract: Described herein is an aqueous composition including tin ions and at least one compound of formula I where X1, X2 are independently selected from a linear or branched C1-C12 alkanediyl, R11 is a monovalent group of formula —(O—CH2—CHR41)m—OR42, R12, R13, R14 are independently selected from H, R11, and R40; R15 is selected from H, R11, R40 and —X4—N(R21)2, X4 is a divalent group selected from (a) a linear or branched C1 to C12 alkanediyl, and (b) formula —(O—CH2—CHR41)o—, R21 is selected from R11 and R40, R40 is a linear or branched C1-C20 alkyl, R41 is selected from H and a linear or branched C1 to C5 alkyl, R42 is selected from H and a linear or branched C1-C20 alkyl, n is an integer of from 1 to 6, m is an integer of from 2 to 250, and o is an integer of from 1 to 250.

公开(公告)号：US20250051949A1

公开(公告)日：2025-02-13

申请号：US18720906

申请日：2022-12-20

Applicant: BASF SE

Inventor： Charlotte EMNET ,  Lucas Benjamin HENDERSON ,  Alexander FLUEGEL ,  Sathana KITAYAPORN ,  Nadine ENGELHARDT

IPC: C25D3/38 ,  C25D5/00 ,  C25D7/12

Abstract: Described herein is a composition for depositing copper on a semiconductor substrate, the composition including
(a) copper ions;
(b) a grain refiner of formula G1a or G1b or salts thereof; (c) a complexing agent; and
(d) optionally a buffer or a base to adjust the pH to a pH of from 7 to 13;
wherein
RG1 is selected from one or more H, C1 to C4 carboxyl, C1 to C4 alkyl, C1 to C6 alkoxy, halogen, and CN;
RG2 is selected from one or more H, C1 to C4 carboxyl, C1 to C4 alkyl, C1 to C6 alkoxy, halogen, and CN; and
XG1 is selected from C1 to 6 alkanediyl or a group —XG11—C(O)—O—XG12—;
XG11 is selected from a chemical bond or C1 to C4 alkandiyl;
XG12 is selected from a chemical bond or C1 to C4 alkandiyl; and wherein RG1 or RG2, comprises at least one C1 to C4 carboxyl group, or group XG1 is —XG11—C(O)—O—)—XG12—; wherein the pH of the composition is from 7 to 13.