Invention Application
- Patent Title: FINFET SRAM CELLS WITH REDUCED FIN PITCH
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Application No.: US17810673Application Date: 2022-07-05
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Publication No.: US20220336472A1Publication Date: 2022-10-20
- Inventor: Chih-Hao Wang , Yi-Hsun Chiu , Yi-Hsiung Lin , Shang-Wen Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/088 ; H01L29/417 ; H01L21/762 ; H01L29/423

Abstract:
An integrated circuit (IC) includes a first p-type semiconductor fin, a first dielectric fin, a first hybrid fin, a second hybrid fin, a second dielectric fin, and a second p-type semiconductor fin disposed in this order along a first direction and oriented lengthwise along a second direction, where each of the first and the second hybrid fins has a first portion including an n-type semiconductor material and a second portion including a dielectric material. The IC further includes n-type source/drain (S/D) epitaxial features disposed over each of the first and the second p-type semiconductor fins, p-type S/D epitaxial features disposed over the first portion of each of the first and the second hybrid fins, and S/D contacts physically contacting each of the p-type S/D epitaxial features and the second portion of each of the first and the second hybrid fins.
Information query
IPC分类: