Invention Application
- Patent Title: BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR PRODUCING BONDING STRUCTURE
-
Application No.: US17812352Application Date: 2022-07-13
-
Publication No.: US20220347799A1Publication Date: 2022-11-03
- Inventor: Katsuaki SUGANUMA , Chuantong CHEN , Toshiyuki ISHINA , Seungjun NOH , Chanyang CHOE
- Applicant: OSAKA UNIVERSITY
- Applicant Address: JP Osaka
- Assignee: OSAKA UNIVERSITY
- Current Assignee: OSAKA UNIVERSITY
- Current Assignee Address: JP Osaka
- Priority: JP2017-032043 20170223
- Main IPC: B23K35/30
- IPC: B23K35/30 ; H01L23/00 ; B32B15/01
Abstract:
A bonding member (10) includes surface-processed silver surfaces (11a, 11b).
Public/Granted literature
- US12134146B2 Bonding member, method for producing bonding member and method for producing bonding structure Public/Granted day:2024-11-05
Information query
IPC分类:
