- 专利标题: 3-D PRINTED PACKAGING
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申请号: US17713208申请日: 2022-04-04
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公开(公告)号: US20220348363A1公开(公告)日: 2022-11-03
- 发明人: Shay C. Colson , David A. Divine , David S. Thompson , Patrick Molvik , James L. Schmeling
- 申请人: Shay C. Colson , David A. Divine , David S. Thompson , Patrick Molvik , James L. Schmeling
- 申请人地址: US WA Bellingham; US WA Nine Mile Falls; US WA Spokane; US WA Newport; US MD Brookeville
- 专利权人: Shay C. Colson,David A. Divine,David S. Thompson,Patrick Molvik,James L. Schmeling
- 当前专利权人: Shay C. Colson,David A. Divine,David S. Thompson,Patrick Molvik,James L. Schmeling
- 当前专利权人地址: US WA Bellingham; US WA Nine Mile Falls; US WA Spokane; US WA Newport; US MD Brookeville
- 主分类号: B65B3/02
- IPC分类号: B65B3/02 ; B65D1/40 ; B33Y30/00 ; B33Y40/00 ; B33Y80/00 ; B65D81/02 ; B65B57/12 ; B65B61/26 ; B65B59/00 ; B65B5/02 ; B29C64/124 ; B29C64/112 ; B29D99/00 ; B29C64/118 ; B29C64/153
摘要:
Items may be packaged for shipping or storage using additive manufacturing techniques, also known as three dimensional (3-D) printing. Packages made by such processes may be referred to as 3-D printed packages and may include packing material printed at least partially around the item(s) and/or an outer cover printed about at least a portion of an exterior of the packing material and/or the item(s). A packaging system may include a 3-D printer and a computing device communicatively coupled to the 3-D printer. The computing device may obtain a packaging model describing a package for one or more items. A print module of the computing device may include instructions to print the package at least partially about the item(s) according to the packaging model.
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