- 专利标题: SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME
-
申请号: US17710830申请日: 2022-03-31
-
公开(公告)号: US20220352130A1公开(公告)日: 2022-11-03
- 发明人: JEONG HYUN LEE , HWAN PIL PARK , JONG BO SHIM
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2021-0057364 20210503
- 主分类号: H01L25/16
- IPC分类号: H01L25/16 ; H01L23/00 ; H01L23/48 ; H01L23/498 ; H01L21/48
摘要:
A semiconductor package includes; a substrate including a first insulating layer and a first conductive pattern in the first insulating layer, a first semiconductor chip on the substrate, an interposer spaced apart from the first semiconductor chip in a direction perpendicular to an upper surface of the substrate and including a second insulating layer and a second conductive pattern in the second insulating layer, a first element between the first semiconductor chip and the interposer, a connection member between the substrate and the interposer, and a mold layer covering side surfaces of the first semiconductor chip and side surfaces of the first element.
信息查询
IPC分类: