公开(公告)号：US20220352130A1

公开(公告)日：2022-11-03

申请号：US17710830

申请日：2022-03-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEONG HYUN LEE ,  HWAN PIL PARK ,  JONG BO SHIM

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/48 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor package includes; a substrate including a first insulating layer and a first conductive pattern in the first insulating layer, a first semiconductor chip on the substrate, an interposer spaced apart from the first semiconductor chip in a direction perpendicular to an upper surface of the substrate and including a second insulating layer and a second conductive pattern in the second insulating layer, a first element between the first semiconductor chip and the interposer, a connection member between the substrate and the interposer, and a mold layer covering side surfaces of the first semiconductor chip and side surfaces of the first element.