Invention Application
- Patent Title: INTEGRATED CIRCUIT WITH BACKSIDE TRENCH FOR METAL GATE DEFINITION
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Application No.: US17484956Application Date: 2021-09-24
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Publication No.: US20220352150A1Publication Date: 2022-11-03
- Inventor: Kuo-Cheng CHIANG , Jung-Chien CHENG , Shi-Ning JU , Guan-Lin CHEN , Chih-Hao WANG
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/423 ; H01L21/762 ; H01L29/66

Abstract:
An integrated circuit includes a first nanosheet transistor and a second nanosheet transistor on a substrate. The first and second nanosheet each include gate electrodes. A gate isolation structure extends from a backside of the substrate between the gate electrodes. The gate isolation structure physically and electrically isolates the first and second gate electrodes from each other.
Public/Granted literature
- US11855079B2 Integrated circuit with backside trench for metal gate definition Public/Granted day:2023-12-26
Information query
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