Invention Application
- Patent Title: RESIN COMPOSITION, ENCAPSULATION STRUCTURE, AND METHOD FOR MANUFACTURING RESIN COMPOSITION
-
Application No.: US17360558Application Date: 2021-06-28
-
Publication No.: US20220356342A1Publication Date: 2022-11-10
- Inventor: Cheng-Yi LIN , Shih-Ming CHEN
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TW110116733 20210510
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L33/04 ; C08J5/18
Abstract:
A resin composition is provided, which includes a first polymer and a second polymer. The first polymer is formed by a reaction of an epoxy resin modified with a first elastic molecular segment and an epoxy resin curing agent. The second polymer is formed by a polymerization of an acrylate modified with a second elastic molecular segment.
Information query
