Invention Application
- Patent Title: Fan-Out Packages and Methods of Forming the Same
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Application No.: US17870423Application Date: 2022-07-21
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Publication No.: US20220359356A1Publication Date: 2022-11-10
- Inventor: Chih-Chiang Tsao , Chao-Wei Chiu , Hsuan-Ting Kuo , Chia-Lun Chang , Cheng-Shiuan Wong , Hsiu-Jen Lin , Ching-Hua Hsieh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L21/48

Abstract:
A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.
Information query
IPC分类: