Invention Application
- Patent Title: DISPLAY MODULE INCLUDING GLASS SUBSTRATE HAVING SIDE WIRINGS, AND DISPLAY MODULE MANUFACTURING METHOD
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Application No.: US17873969Application Date: 2022-07-26
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Publication No.: US20220359574A1Publication Date: 2022-11-10
- Inventor: Changjoon LEE , Kyungwoon JANG , Kwangrae JO
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0026591 20200303
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L25/075 ; H01L33/00

Abstract:
A display module includes a glass substrate having a TFT layer and a driver circuit disposed on surfaces thereof, LEDs electrically connected to the TFT layer; first connection pads formed in an edge region of the front surface; second connection pads formed in an edge region of the rear surface; and side wirings in recessed grooves arranged at intervals on a side of the glass substrate so that the side wirings are located at concave positions from the side of the glass substrate, the side wirings electrically connecting the first and second connection pads, wherein the first and second connection pads are spaced a predetermined distance inward from the side of the glass substrate, and the recessed grooves are arranged so that opposite ends of the recessed grooves are located at positions corresponding to the first and second connection pads, respectively.
Information query
IPC分类: