公开(公告)号：US20210135076A1

公开(公告)日：2021-05-06

申请号：US17259681

申请日：2019-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki JUNG ,  Jinho KIM ,  Dongmyung SON ,  Sangmin SHIN ,  Changjoon LEE ,  Kyungwoon JANG ,  Seongphil CHO ,  Gyun HEO ,  Soonmin HONG

IPC: H01L33/62

Abstract: A display panel is disclosed. The disclosed display panel includes a thin film transistor substrate, a plurality of micro LEDs arranged on one surface of the thin film transistor substrate, a plurality of first connection pads disposed on the one surface of the thin film transistor substrate, a plurality of second connection pads disposed on the other surface of the thin film transistor substrate that faces the one surface, and a plurality of connection wirings disposed on a side surface of the thin film transistor substrate for electrically connecting each of the plurality of first connection pads and the plurality of second connection pads, wherein at least one of an edge region on the one surface and an edge region on the other surface of the thin film transistor substrate includes a cutting area which is cut in an inward direction of the thin film transistor substrate.

公开(公告)号：US20240274773A1

公开(公告)日：2024-08-15

申请号：US18642363

申请日：2024-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Kyungwoon JANG

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L2224/29028 ,  H01L2224/32225 ,  H01L2224/83203 ,  H01L2924/12041 ,  H01L2933/0066

Abstract: A display panel manufacturing method includes: putting a first substrate into a liquid; putting a plurality of light emitting diodes into the liquid in which the first substrate is put; performing fluidic self-assembly to attach the plurality of light emitting diodes to the first substrate; transferring the plurality of light emitting diodes attached to the first substrate to a second substrate; and thermally compressing the plurality of light emitting diodes transferred to the second substrate onto the second substrate.

公开(公告)号：US20230223388A1

公开(公告)日：2023-07-13

申请号：US18121939

申请日：2023-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Tackmo LEE ,  Kyungwoon JANG ,  Gyun HEO ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L25/0753

Abstract: A display module including a plurality of pixels, according to an embodiment, may include: a first substrate: a plurality of inorganic light-emitting elements disposed on the upper surface of the first substrate; a plurality of micro pixel controllers disposed on the lower surface of the first substrate; and a driver IC which transmits driving signals to the plurality of micro pixel controllers, wherein each of the plurality of pixels includes two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and each of the plurality of micro pixel controllers controls two or more pixels among the plurality of pixels.

公开(公告)号：US20200321229A1

公开(公告)日：2020-10-08

申请号：US16761905

申请日：2018-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Byunghoon LEE ,  Min PARK ,  Kyungwoon JANG ,  Jeonggen YOON ,  Hyuntae JANG

IPC: H01L21/67 ,  H01L25/075 ,  B65G47/90

Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.

公开(公告)号：US20240255563A1

公开(公告)日：2024-08-01

申请号：US18602717

申请日：2024-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Changkyu CHUNG ,  Kyungwoon JANG ,  Daeseok HWANG

IPC: G01R31/26

CPC classification number: G01R31/2635

Abstract: An electroluminescence inspection apparatus includes a first substrate, and electrode members arranged at a first surface of the first substrate, and electrically contacted respectively with a chip electrode pad of light emitting diodes arranged at a second substrate based on performing an electroluminescence inspection, wherein an electrode member includes contact protrusions configured to be elastically contacted at a chip electrode member of the light emitting diode based on the first substrate is pressed by the second substrate.

公开(公告)号：US20230253388A1

公开(公告)日：2023-08-10

申请号：US18134908

申请日：2023-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Gyun HEO ,  Tackmo LEE ,  Kyungwoon JANG ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L33/62 ,  G09G3/32

CPC classification number: H01L25/167 ,  H01L33/62 ,  G09G3/32 ,  G09G2300/026 ,  G09G2300/0842 ,  G09G2300/0426 ,  G09G2300/0452

Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.

公开(公告)号：US20220359574A1

公开(公告)日：2022-11-10

申请号：US17873969

申请日：2022-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Kyungwoon JANG ,  Kwangrae JO

IPC: H01L27/12 ,  H01L25/075 ,  H01L33/00

Abstract: A display module includes a glass substrate having a TFT layer and a driver circuit disposed on surfaces thereof, LEDs electrically connected to the TFT layer; first connection pads formed in an edge region of the front surface; second connection pads formed in an edge region of the rear surface; and side wirings in recessed grooves arranged at intervals on a side of the glass substrate so that the side wirings are located at concave positions from the side of the glass substrate, the side wirings electrically connecting the first and second connection pads, wherein the first and second connection pads are spaced a predetermined distance inward from the side of the glass substrate, and the recessed grooves are arranged so that opposite ends of the recessed grooves are located at positions corresponding to the first and second connection pads, respectively.

公开(公告)号：US20240258292A1

公开(公告)日：2024-08-01

申请号：US18440304

申请日：2024-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Changjoon LEE ,  Kyungwoon JANG

IPC: H01L25/16 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/03 ,  H01L24/08 ,  H01L24/16 ,  H01L2224/03831 ,  H01L2224/0384 ,  H01L2224/03848 ,  H01L2224/08059 ,  H01L2224/08113 ,  H01L2224/16258 ,  H01L2924/12041

Abstract: A micro light emitting diode (LED) chip includes: a first semiconductor layer doped with an N-type dopant; a second semiconductor layer provided at a lower surface of the first semiconductor layer, and doped with a P-type dopant; an active layer provided between the first semiconductor layer and the second semiconductor layer, and configured to emit light; and an electrode pad provided at a lower surface of the second semiconductor layer, wherein the electrode pad may include a groove structure having a depth that increases from an edge of the electrode pad towards a center of the electrode pad.

公开(公告)号：US20220415873A1

公开(公告)日：2022-12-29

申请号：US17902611

申请日：2022-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changsun KANG ,  Huigyeong AHN ,  Kyungwoon JANG ,  Sangtae HAN ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  G09G3/32 ,  G09G3/20

Abstract: A display module includes a first substrate; a plurality of micro-pixel packages provided on an upper surface of the first substrate and including a plurality of pixels arranged in two dimensions; a plurality of micro-pixel controllers provided on the upper surface of the first substrate and configured to control the plurality of micro-pixel packages; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein upper ends of the plurality of micro-pixel packages are positioned higher than upper ends of the plurality of micro-pixel controllers with respect to the upper surface of the first substrate.

公开(公告)号：US20220149112A1

公开(公告)日：2022-05-12

申请号：US17524421

申请日：2021-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daesuck HWANG ,  Kyungwoon JANG ,  Changkyu CHUNG ,  Gyun HEO ,  Soonmin HONG

IPC: H01L27/15 ,  H01L33/00

Abstract: A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.