公开(公告)号：US20220359574A1

公开(公告)日：2022-11-10

申请号：US17873969

申请日：2022-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Kyungwoon JANG ,  Kwangrae JO

IPC: H01L27/12 ,  H01L25/075 ,  H01L33/00

Abstract: A display module includes a glass substrate having a TFT layer and a driver circuit disposed on surfaces thereof, LEDs electrically connected to the TFT layer; first connection pads formed in an edge region of the front surface; second connection pads formed in an edge region of the rear surface; and side wirings in recessed grooves arranged at intervals on a side of the glass substrate so that the side wirings are located at concave positions from the side of the glass substrate, the side wirings electrically connecting the first and second connection pads, wherein the first and second connection pads are spaced a predetermined distance inward from the side of the glass substrate, and the recessed grooves are arranged so that opposite ends of the recessed grooves are located at positions corresponding to the first and second connection pads, respectively.

公开(公告)号：US20200152721A1

公开(公告)日：2020-05-14

申请号：US16680764

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changjoon LEE ,  Kyungwoon JANG ,  Gyun HEO ,  Youngjun MOON ,  Kwangrae JO ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L27/32 ,  H05B33/10 ,  H05B33/08

Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.