Invention Application
- Patent Title: FinFETs and Methods of Forming FinFETs
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Application No.: US17814681Application Date: 2022-07-25
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Publication No.: US20220359756A1Publication Date: 2022-11-10
- Inventor: Chin-Hsiang Lin , Tai-Chun Huang , Tien-I Bao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/417 ; H01L21/768 ; H01L21/02 ; H01L21/033 ; H01L21/8234 ; H01L23/528 ; H01L29/66

Abstract:
An embodiment is a method including recessing a gate electrode over a semiconductor fin on a substrate to form a first recess from a top surface of a dielectric layer, forming a first mask in the first recess over the recessed gate electrode, recessing a first conductive contact over a source/drain region of the semiconductor fin to form a second recess from the top surface of the dielectric layer, and forming a second mask in the second recess over the recessed first conductive contact.
Public/Granted literature
- US12087861B2 FinFETs and methods of forming FinFETs Public/Granted day:2024-09-10
Information query
IPC分类: