A method produces a substrate shielded from electromagnetic radiation. The method includes i) providing a first polymer material (a) or a precursor thereof containing at least one conductive filler and at least a second polymer material (b) or precursor thereof; ii) obtaining a substrate by subjecting the first polymer material (a) or the precursor thereof and the second polymer material (b) or the precursor thereof to shaping with material bonding of the first polymer material (a) and the second polymer material (b), and polymerizing, if present, the precursors; and iii) at least partially surrounding an electronic component with the substrate obtained in step ii). A polymer component of the first polymer material (a) includes a thermoplastic elastomer or at least one thermoplastic elastomer, selected from the group consisting of, e.g., thermoplastic polyamide elastomers, thermoplastic copolyester elastomers, thermoplastic olefin-based elastomers, thermoplastic styrene block copolymers, polyether block amides, and mixtures thereof.