Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE
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Application No.: US17668538Application Date: 2022-02-10
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Publication No.: US20220367331A1Publication Date: 2022-11-17
- Inventor: Sangwon Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0062974 20210514
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L23/31

Abstract:
A semiconductor package includes a base substrate having a plurality of upper pads and a plurality of first and second lower pads, a semiconductor chip disposed on the base substrate and electrically connected to the plurality of upper pads, a solder resist layer having a plurality of openings exposing a region of each of the plurality of first and second lower pads, the exposed regions of the plurality of first and second lower pads having the same size, a plurality of first external connection conductors respectively disposed on the exposed regions of the plurality of first lower pads and having a first height and a first volume, and a plurality of second external connection conductors respectively disposed on the exposed regions of the plurality of second lower pads and having a second height, greater than the first height, and a second volume, greater than the first volume.
Public/Granted literature
- US12230557B2 Semiconductor package Public/Granted day:2025-02-18
Information query
IPC分类: