BALL ATTACH TOOL
    2.
    发明申请

    公开(公告)号:US20250089179A1

    公开(公告)日:2025-03-13

    申请号:US18601190

    申请日:2024-03-11

    Abstract: A ball attach tool may include a housing a valve module. The housing may include a plurality of pick-up holes configured to pick up balls when a reduced pressure is applied thereto. The valve module may control a reduced pressure applied to the pick-up holes.

    Image processing apparatus and operating method thereof

    公开(公告)号:US12190471B2

    公开(公告)日:2025-01-07

    申请号:US17723055

    申请日:2022-04-18

    Abstract: An image processing apparatus for performing image quality processing on an image includes: a memory configured to store one or more instructions; and a processor configured to execute the one or more instructions stored in the memory to: obtain a first image by downscaling an input image by using a downscale network; extract first feature information corresponding to the first image by using a feature extraction network; obtain a second image by performing image quality processing on the first image based on the first feature information, by using an image quality processing network; and obtain an output image by upscaling the second image, extracting second feature information corresponding to the input image, and performing image quality processing on the upscaled second image based on the second feature information, by using an upscale network.

    SEMICONDUCTOR PACKAGE
    6.
    发明申请

    公开(公告)号:US20220367331A1

    公开(公告)日:2022-11-17

    申请号:US17668538

    申请日:2022-02-10

    Inventor: Sangwon Lee

    Abstract: A semiconductor package includes a base substrate having a plurality of upper pads and a plurality of first and second lower pads, a semiconductor chip disposed on the base substrate and electrically connected to the plurality of upper pads, a solder resist layer having a plurality of openings exposing a region of each of the plurality of first and second lower pads, the exposed regions of the plurality of first and second lower pads having the same size, a plurality of first external connection conductors respectively disposed on the exposed regions of the plurality of first lower pads and having a first height and a first volume, and a plurality of second external connection conductors respectively disposed on the exposed regions of the plurality of second lower pads and having a second height, greater than the first height, and a second volume, greater than the first volume.

Patent Agency Ranking