Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US17321139Application Date: 2021-05-14
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Publication No.: US20220367384A1Publication Date: 2022-11-17
- Inventor: You-Lung YEN , Bernd Karl APPELT , Kay Stefan ESSIG
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/495 ; H01L21/56 ; H01L23/433
Abstract:
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a substrate, a semiconductor device, an encapsulant, a balance structure, and a warpage-resistant layer. The semiconductor device is disposed on the substrate. The encapsulant encapsulates the semiconductor device. The balance structure is on the semiconductor device and contacting the encapsulant. The warpage-resistant layer is between the semiconductor device and the balance structure. The encapsulant contacts a lateral surface of the warpage-resistant layer.
Public/Granted literature
- US12009317B2 Semiconductor package structure and method for manufacturing the same Public/Granted day:2024-06-11
Information query
IPC分类:
