Invention Application
- Patent Title: Packages With Multiple Types of Underfill and Method Forming The Same
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Application No.: US17383911Application Date: 2021-07-23
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Publication No.: US20220367413A1Publication Date: 2022-11-17
- Inventor: Kuan-Yu Huang , Li-Chung Kuo , Sung-Hui Huang , Shang-Yun Hou
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L23/498 ; H01L25/00 ; H01L23/31
Abstract:
A method includes bonding a first package component over a second package component, dispensing a first underfill between the first package component and the second package component, and bonding a third package component over the second package component. A second underfill is between the third package component and the second package component. The first underfill and the second underfill are different types of underfills.
Public/Granted literature
- US12087733B2 Packages with multiple types of underfill and method forming the same Public/Granted day:2024-09-10
Information query
IPC分类:
