Invention Application
- Patent Title: OPTICAL-DEVICE-MOUNTING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIIC MODULE
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Application No.: US17765182Application Date: 2020-09-29
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Publication No.: US20220376469A1Publication Date: 2022-11-24
- Inventor: Akihiko KITAGAWA , Takashi KIMURA
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Priority: JP2019-178922 20190930
- International Application: PCT/JP2020/036790 WO 20200929
- Main IPC: H01S5/024
- IPC: H01S5/024 ; H01S5/02255 ; H01S5/02208 ; H01S5/02315

Abstract:
An optical-device-mounting package includes a base member having an upper surface and a slope, the slope being continuous with the upper surface and sloping downward in a direction away from the upper surface; and an optical component having a first face and a second face, the second face being positioned opposite the first face. At least a part of the optical component is at a position higher than the upper surface, with at least a part of the second face being bonded to the slope with a bonding material. The bonding material spreads from an area between the second face and the slope up to an area between the second face and the base member and higher than the upper surface.
Information query