公开(公告)号：US20250055252A1

公开(公告)日：2025-02-13

申请号：US18929162

申请日：2024-10-28

Applicant: NICHIA CORPORATION

Inventor： Tatsuya KANAZAWA ,  Kazuma KOZURU

IPC: H01S5/02234 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/0236 ,  H01S5/40

Abstract: A light-emitting device includes: one or more light-emitting elements; a package in which the one or more light-emitting elements are arranged, the package including one or more wiring regions; an optical member fixed to the package, the optical member having a lens portion having a lens surface including a first lens, and a non-lens portion that is a portion that does not overlap the lens surface in a top view; and one or more adhesives fixing the optical member to the package. The package has an emission surface through which light from the one or more light-emitting elements exits the package. The optical member has an incidence surface on which the light exiting the package enters the optical member, and the lens surface from which the light that has entered the optical member exits the optical member.

公开(公告)号：US12224551B2

公开(公告)日：2025-02-11

申请号：US17444082

申请日：2021-07-30

Applicant: OSRAM Opto Semiconductors GmbH ,  LUMUS LTD.

Inventor： Yochay Danziger ,  Ann Russell

IPC: H01S5/02253 ,  H01S5/02255 ,  H01S5/40 ,  G03B21/20

Abstract: A laser device comprises a plurality of laser diodes, each laser diode emitting a light beam having a fast axis and a slow axis and a beam direction; and one or more optical components configured to modify a divergence of the light beams in a fast axis plane and/or in a slow axis plane such that the light beams have a same focal plane in the fast axis plane and in the slow axis plane.

公开(公告)号：US12191626B1

公开(公告)日：2025-01-07

申请号：US17444273

申请日：2021-08-02

Applicant: KYOCERA SLD Laser, Inc.

Inventor： Melvin McLaurin

IPC: H01S5/02 ,  H01L21/78 ,  H01L29/20 ,  H01L29/778 ,  H01L29/861 ,  H01L29/872 ,  H01L33/00 ,  H01L33/24 ,  H01L33/32 ,  H01L33/62 ,  H01S5/00 ,  H01S5/02255 ,  H01S5/028 ,  H01S5/183 ,  H01S5/42

Abstract: Horizontal Cavity Surface Emitting Lasers (HCSELs) with angled facets may be fabricated by a chemical or physical etching process, and the epitaxially grown semiconductor device layers may be transferred through a selective etch and release process from their original epitaxial substrate to a carrier wafer.

公开(公告)号：US20240429675A1

公开(公告)日：2024-12-26

申请号：US18684240

申请日：2022-08-30

Applicant: NIPPON ELECTRIC GLASS CO., LTD.

Inventor： Hiroki FUJITA ,  Hirokazu TANAKA ,  Yoshimasa YAMAGUCHI

IPC: H01S5/023 ,  H01S5/02255 ,  H01S5/0236 ,  H01S5/024

Abstract: Provided is a film-equipped component that, when subjected to a plurality of component mountings involving heating to melting, makes it less likely that any previously mounted component becomes misaligned. A film-equipped component 1 includes: a component main body 2; and an adhesion film 3 provided on a principal surface 2a of the component main body 2, wherein the adhesion film 3 includes: a Ni layer 6 layered directly or indirectly on the principal surface 2a of the component main body 2 and containing Ni; a diffusion suppressing layer 7 provided on the Ni layer 6; and a solder layer 8 provided on the diffusion suppressing layer 7 and containing at least one of Au and Sn.

公开(公告)号：US20240364072A1

公开(公告)日：2024-10-31

申请号：US18565879

申请日：2022-05-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Hubert HALBRITTER ,  Bruno JENTZSCH

IPC: H01S5/00 ,  F21V9/32 ,  F21Y113/00 ,  F21Y115/30 ,  H01S5/02255 ,  H01S5/024 ,  H01S5/42

CPC classification number: H01S5/0087 ,  F21V9/32 ,  H01S5/02255 ,  H01S5/02476 ,  H01S5/42 ,  F21Y2113/00 ,  F21Y2115/30

Abstract: The invention relates to an illumination device having a housing with a light-exit region and an assembly element arranged below the light-exit region. A conversion element is arranged on the assembly element and designed to convert pump light into emission light in a surface region of the conversion element and to emit said emission light via the surface region. Two surface-emitting laser apparatuses for producing the pump light are arranged opposite one another on the assembly region and are arranged laterally offset to the light-exit region and arranged at a distance from the conversion element and at a distance therefrom. A reflector element connected to the housing is arranged above laser apparatuses and designed to reflect the pump light emitted by the laser apparatuses onto the surface region. The assembly element serves the purpose of heat dissipation for the heat produced and, at the same time, substantial thermal decoupling from the conversion element.

公开(公告)号：US12100928B2

公开(公告)日：2024-09-24

申请号：US18310106

申请日：2023-05-01

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC: H01S5/0235 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02355 ,  H01S5/024 ,  H01S5/40

CPC classification number: H01S5/0235 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02469 ,  H01S5/40 ,  H01S5/02255

Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

公开(公告)号：US20240275125A1

公开(公告)日：2024-08-15

申请号：US18563049

申请日：2022-05-24

Applicant: ams-OSRAM International GmbH

Inventor： Hubert HALBRITTER ,  Sven GERHARD ,  Bruno JENTZSCH ,  Tilman RÜGHEIMER ,  Christoph WALTER

IPC: H01S5/02255 ,  H01S5/02 ,  H01S5/02345 ,  H01S5/185 ,  H01S5/323 ,  H01S5/42

CPC classification number: H01S5/02255 ,  H01S5/0207 ,  H01S5/185 ,  H01S5/42 ,  H01S5/02345 ,  H01S5/32341

Abstract: The disclosed optoelectronic semiconductor chip includes a carrier, a semiconductor layer sequence on the carrier having at least one active zone for generating radiation, a layer of high optical refractive index on an output coupling facet of the semiconductor layer sequence for the output coupling of radiation, and a coating of low optical refractive index directly on an outer side of the layer of high optical refractive index for the total internal reflection of the radiation, wherein the semiconductor layer sequence is configured to guide the radiation in the active zone perpendicularly to a growth direction of the semiconductor layer sequence, and the layer of high optical refractive index is configured to deflect the radiation at the outer side parallel to the growth direction.

公开(公告)号：US20240258765A1

公开(公告)日：2024-08-01

申请号：US18040407

申请日：2021-09-28

Applicant: Robert Bosch GmbH

Inventor： Stefan Pinter

IPC: H01S5/02257 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02345 ,  H01S5/40

CPC classification number: H01S5/02257 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02345 ,  H01S5/4031

Abstract: A laser diode device including at least one laser diode. The laser diode is an edge emitter. The laser diode device includes a housing having a transparent optical window, the transparent optical window being embodied as a first side wall of the housing. The housing is designed to shield the laser diode from an external environment of the laser diode device, in particular hermetically. The transparent optical window is designed to transmit at least one laser beam generated by the laser diode into the external environment. The laser diode is at least indirectly fastened to a base of the housing. The side walls of the housing and a housing cover situated opposite the housing base are produced from a multiplicity of wafers, in particular at least three.

公开(公告)号：US12009633B2

公开(公告)日：2024-06-11

申请号：US17285244

申请日：2019-10-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Joerg Sorg

IPC: H01S5/02216 ,  H01S5/0222 ,  H01S5/02255 ,  H01S5/02257 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01S5/02216 ,  H01S5/0222 ,  H01S5/02255 ,  H01S5/02257 ,  H05K1/115 ,  H05K1/181

Abstract: A laser device comprises a hermetic housing that has an interior and is made at least in part of printed circuit board material, a laser element located in the interior, and at least one inorganic layer which hermetically shields the interior from the printed circuit board material.

公开(公告)号：US12003074B2

公开(公告)日：2024-06-04

申请号：US17124282

申请日：2020-12-16

Applicant: Linktel Technologies Co., Ltd.

Inventor： Baiquan Hu ,  Linke Li ,  Xuefeng Lin ,  Dingkun Hu ,  Tianshu Wu ,  Xianwen Yang ,  Jian Zhang

IPC: H01S5/40 ,  H01S5/00 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0236 ,  H01S5/024

CPC classification number: H01S5/02415 ,  H01S5/0064 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0236 ,  H01S5/02469 ,  H01S5/4012 ,  H01S5/4087

Abstract: The present invention provides a multichannel parallel light emitting device comprising a semiconductor cooler, a cold surface of the semiconductor cooler completely covers the area of a hot surface, and when the hot surface and the cold surface are horizontally disposed, a horizontal distance is reserved between the edge of the cold surface and the edge of the hot surface, and a positive electrode and a negative electrode are fixed on a second surface of the cold surface. The semiconductor cooler with the above structure is disposed in a sealed BOX of a BOX package, the bottom surface of the inner wall of the BOX package is provided with a groove for mounting a semiconductor cooler, a hot surface of the semiconductor cooler is fixed at the bottom of the groove, an insulating low thermal conductivity sealing ring is disposed between a lower end of a cold surface of the semiconductor cooler and the BOX package, so that the BOX package, the insulating low thermal conductivity sealing ring and the cold surface of the semiconductor cooler form a closed space, so as to achieve the TEC local hermetic effect, a water-proof film is not required for the TEC, and to ensure the TEC can work in a non-hermetic environment.