公开(公告)号：US12222493B2

公开(公告)日：2025-02-11

申请号：US17601709

申请日：2019-12-19

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Shinya Ito ,  Yohei Enya ,  Takashi Kyono ,  Hiromi Nakanishi

IPC: G02B26/10 ,  G02B26/08 ,  H01S5/022 ,  H01S5/02315

Abstract: An optical module includes a light-forming unit configured to form light, and a protective member surrounding and sealing the light-forming unit. The light-forming unit includes a laser diode, a first MEMS including a first mirror having a first reflective surface that reflects and scans light from the laser diode, the first mirror oscillating to form a first plane, and a second MEMS including a second mirror having a second reflective surface that reflects and scans light from the first mirror, the second mirror oscillating to form a second plane orthogonal to the first plane.

公开(公告)号：US20250015557A1

公开(公告)日：2025-01-09

申请号：US18702124

申请日：2022-10-24

Applicant: SHENZHEN LIGHTING INSTITUTE

Inventor： Huai Tang ,  Yanyu Guo

IPC: H01S5/02315 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/40

Abstract: A laser packaging device (1), comprising a base (10), a laser light source component (30), a lead wire (50), and a light window (60). The base (10) comprises a light source mounting portion (11) and a support portion (13); the light source mounting portion (11) and the support portion (13) are integrally arranged, and the light source mounting portion cooperates with the support portion (13) to form an accommodating cavity (15); the support portion (13) comprises a top surface (132) and a bottom surface (134); the laser light source component (30) is accommodated in the accommodating cavity (15) and is provided at the light source mounting portion (11); the laser light source component (30) is configured to emit laser; the lead wire (50) passes through the support portion (13); the lead wire (50) comprises a first end (52) and a second end (54) opposite to each other; the first end (52) is provided in the accommodating cavity (15) and is configured to be electrically connected with the laser light source component (30); the second end (54) is provided on the bottom surface (134); the light window (60) covers the top surface (132) to seal the accommodating cavity (15); and the laser is emitted through the light window (60). The light source mounting portion (11) and the support portion (13) are integrally arranged, thereby simplifying the manufacturing process of the base (10). In addition, the first end (52) of the lead wire (50) is provided in the accommodating cavity (15), and the second end (54) is provided on the bottom surface (134) of the support portion (13), thereby facilitating a decrease in the size of the base (10) and achievement of miniaturization of the laser packing device (1).

公开(公告)号：US20240421558A1

公开(公告)日：2024-12-19

申请号：US18699604

申请日：2022-09-01

Applicant: ams-OSRAM International GmbH

Inventor： Tansen VARGHESE ,  Alvaro GOMEZ-IGLESIAS ,  Martin HETZL

IPC: H01S5/026 ,  H01S5/02315

Abstract: An optoelectronic device is specified including emitters, each emitter configured to emit electromagnetic radiation, and an assigned receiver for each emitter, configured to receive at least part of the electromagnetic radiation emitted by the emitter, wherein the emitters are configured to be operated with an input voltage, each receiver is configured to provide at least part of an output voltage, each emitter is physically connected to the assigned receiver.

公开(公告)号：US20240405506A1

公开(公告)日：2024-12-05

申请号：US18673150

申请日：2024-05-23

Applicant: NICHIA CORPORATION

Inventor： Daisuke KASAI

IPC: H01S5/02315 ,  H01S5/024 ,  H01S5/042

Abstract: A light-emitting module includes a mounting substrate and a light-emitting device. The mounting substrate includes first and second mounting portions and an insulating portion. The first mounting portion has a first upper surface. The second mounting portion has a second upper surface at a position higher than a position of the first upper surface. The insulating portion covers only a part of a region of the first upper surface, only a part of a region of the second upper surface, and a region between the first upper surface and the second upper surface. The light-emitting device has a lower surface mounted on the mounting substrate so as to overlap with at least a part of the first mounting portion, at least a part of the second mounting portion, and at least a part of the insulating portion in a top view.

公开(公告)号：US20240275127A1

公开(公告)日：2024-08-15

申请号：US18568308

申请日：2022-06-09

Applicant: ams-OSRAM International GmbH

Inventor： Jörg Erich SORG ,  Erik HEINEMANN ,  André SOMERS ,  Thomas KIPPES ,  Sebastian SCHLEGL ,  Matthias HEIDEMANN

IPC: H01S5/042 ,  H01S5/02315 ,  H01S5/22

CPC classification number: H01S5/04257 ,  H01S5/02315 ,  H01S5/22

Abstract: A semiconductor chip with a structured chip back side is specified, the chip back side being configured for electrical and thermal linking of the semiconductor chip, the semiconductor chip having emitter regions configured for producing electromagnetic radiation and the structured chip back side having connection pads configured for electrical linking of the emitter regions. The connection pads are p-contacts or n-contacts, with, in a plan view, all connection pads (which are configured either as p-contacts or as n-contacts overlapping with at least two of the emitter regions in each case and each of these connection pads being configured for electrical linking of only one of the emitter regions. Moreover, a component is specified, in particular comprising at least one such semiconductor chip.

公开(公告)号：US11955768B2

公开(公告)日：2024-04-09

申请号：US18183506

申请日：2023-03-14

Applicant: NICHIA CORPORATION

Inventor： Kiyoshi Enomoto

IPC: H01S5/02257 ,  H01S5/02216 ,  H01S5/02255 ,  H01S5/02315 ,  H01S5/02345 ,  H01S5/40

CPC classification number: H01S5/02257 ,  H01S5/02216 ,  H01S5/02255 ,  H01S5/02315 ,  H01S5/02345 ,  H01S5/4031 ,  H01S5/4093

Abstract: A light-emitting device includes: a base including: a mount surface, and a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions located opposite to each other in a first direction which is parallel to a side of the mount surface, and a pair of second protrusions located opposite to each other in a second direction which is perpendicular to the first direction, the second protrusions being provided lower than the first protrusions; one or more light-emitting elements mounted on the mount surface of the base; a first light-transmissive member sealing a space in which the one or more light-emitting elements are mounted; and one or more wires connecting to the one or more light-emitting elements, the one or more wires being bonded on conduction regions provided on at least one of upper surfaces of the second protrusions.

公开(公告)号：US11955403B2

公开(公告)日：2024-04-09

申请号：US17206275

申请日：2021-03-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yasuyuki Kimura ,  Takumi Ikeda

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/367 ,  H01L23/38 ,  H01L33/48 ,  H01L33/64 ,  H01S5/0231 ,  H01S5/02315

CPC classification number: H01L23/373 ,  H01L23/31 ,  H01L23/367 ,  H01L23/38 ,  H01L33/483 ,  H01L33/641 ,  H01S5/0231 ,  H01S5/02315

Abstract: A header for a semiconductor package includes: an eyelet having an upper surface and a lower surface; a first metal block molded integrally with the eyelet, protruding at the upper surface, and having a substantially U shape; a first lead sealed in a first through hole penetrating the eyelet; a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface fixed to a first end surface of the first metal block; a second lead sealed in a second through hole penetrating the eyelet; and a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface fixed to a second end surface of the first metal block.

公开(公告)号：US20240071788A1

公开(公告)日：2024-02-29

申请号：US18270610

申请日：2021-12-30

Applicant: Viatron Co., Ltd.

Inventor： Hyoung June Kim ,  Byung Kuk Kim ,  Wang Jun Park ,  Jin Hong Lee ,  Nam Chun Lee

IPC: H01L21/67 ,  H01S5/02315 ,  H01S5/024 ,  H05B3/00 ,  H05B3/03

CPC classification number: H01L21/67115 ,  H01S5/02315 ,  H01S5/02423 ,  H05B3/0047 ,  H05B3/03 ,  H05B2203/025

Abstract: The present disclosure discloses a flat substrate heating apparatus including a module support plate having a plurality of unit module regions placed on an upper surface thereof; a plurality of laser light source modules having a plurality of laser light source devices and seated on unit module regions of the module support plate, respectively; a power supply board placed below the module support plate and configured to supply power to the laser light source module; and an electrode terminal electrically connecting the laser light source module and the power supply board while detachably securing them to upper and lower surfaces of the module support plate.

公开(公告)号：US20240006841A1

公开(公告)日：2024-01-04

申请号：US18255124

申请日：2021-11-29

Applicant: ams-OSRAM International GmbH

Inventor： Jörg Erich SORG

IPC: H01S5/02315 ,  H01S5/0237 ,  H01S5/22 ,  H01S5/042

CPC classification number: H01S5/02315 ,  H01S5/0237 ,  H01S5/22 ,  H01S5/04256

Abstract: The invention relates to a radiation-emitting laser component including:—an edge-emitting laser diode which is designed to generate electromagnetic laser radiation, and—a substrate, on which the edge-emitting laser diode is arranged, wherein—the edge-emitting laser diode has a contact layer,—the substrate has a substrate web, and—the contact layer is connected to the substrate web by means of a solder layer in a mechanically stable manner. The invention also relates to a method for producing a radiation-emitting laser component.

公开(公告)号：US20230361096A1

公开(公告)日：2023-11-09

申请号：US18068252

申请日：2022-12-19

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Kevin WANG ,  Michael MILLER ,  Steve CHUENG ,  Mikhail DOLGANOV ,  Lijun ZHU

IPC: H01L25/16 ,  H01S5/183 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02315 ,  H01S5/0239 ,  H01S5/026

CPC classification number: H01L25/167 ,  H01L25/165 ,  H01S5/18388 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02315 ,  H01S5/0239 ,  H01S5/0261 ,  H01S5/02257

Abstract: An optical package may include a fan-out-wafer-level-packaging (FOWLP) sub-package including a redistribution layer (RDL) on a molded component including an electrical chip. The optical package may include an optical chip over the FOWLP sub-package. The optical chip may be electrically connected to the RDL. An area of a surface of the RDL may be larger than an area of a surface of the optical chip. The optical package may include a package housing over the optical chip such that light to be received or transmitted by the optical chip may is to pass through the package housing.