Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US17334571Application Date: 2021-05-28
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Publication No.: US20220384310A1Publication Date: 2022-12-01
- Inventor: Chin-Cheng KUO
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L21/768
Abstract:
A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a semiconductor substrate, a conductive structure and at least one via structure. The conductive structure is disposed on an upper surface of the semiconductor substrate. The at least one via structure is disposed in the semiconductor substrate. A portion of the at least one via structure extends beyond the conductive structure.
Public/Granted literature
- US11631631B2 Semiconductor device including via structure for vertical electrical connection Public/Granted day:2023-04-18
Information query
IPC分类:
