Invention Application
- Patent Title: Gate Isolation for Multigate Device
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Application No.: US17884694Application Date: 2022-08-10
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Publication No.: US20220384429A1Publication Date: 2022-12-01
- Inventor: Kuo-Cheng Chiang , Shi Ning Ju , Guan-Lin Chen , Kuan-Ting Pan , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/762 ; H01L29/786 ; H01L29/423

Abstract:
Gate cutting techniques disclosed herein form gate isolation fins to isolate metal gates of multigate devices from one another before forming the multigate devices, and in particular, before forming the metal gates of the multigate devices. An exemplary device includes a first multigate device having first source/drain features and a first metal gate that surrounds a first channel layer and a second multigate device having second source/drain features and a second metal gate that surrounds a second channel layer. A gate isolation fin, which separates the first metal gate and the second metal gate, includes a first dielectric layer having a first dielectric constant and a second dielectric layer having a second dielectric constant disposed over the first dielectric layer. The second dielectric constant is less than the first dielectric constant. A gate isolation end cap may be disposed on the gate isolation fin to provide additional isolation.
Public/Granted literature
- US11990471B2 Gate isolation for multigate device Public/Granted day:2024-05-21
Information query
IPC分类: